Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | TSOP(44) |
| Pkg. Code: | pkg_11787 |
| Lead Count (#): | 44 |
| Pkg. Dimensions (mm): | 18 x 10 x 1.2 |
| Pitch (mm): | 0.8 |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | 3 |
| ECCN (US) | 3A991.b.2.a |
| HTS (US) | 8542.32.0041 |
| RoHS (RMLV0808BGSB-4S2#HA0) | EnglishJapanese |
| Pb (Lead) Free | Yes |
Product Attributes
| Carrier Type | Embossed Tape |
| Moisture Sensitivity Level (MSL) | 3 |
| Country of Assembly | CHINA, MALAYSIA, TAIWAN |
| Country of Wafer Fabrication | JAPAN |
| Access Time (ns) | 45 |
| Density (Kb) | 8000 |
| Lead Compliant | Yes |
| Lead Count (#) | 44 |
| Length (mm) | 18 |
| Longevity | 2032 Dec |
| MOQ | 1000 |
| Memory Capacity (kbit) | 8000 |
| Memory Density | 8 |
| Organization | 1M x 8 |
| Organization (bit) | x 8 |
| Organization (kword) | 1000 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 18 x 10 x 1.2 |
| Pkg. Type | TSOP(44) |
| Price (USD) | $5.57106 |
| Remarks | Dual Chip Select (CS1#, CS2) |
| Replacement Remark | Change in generation from 0.15 um to 0.11 um |
| Supply Voltage (V) | 2.4 - 3.6 |
| Tape & Reel | No |
| Temp. Range (°C) | -40 to +85 |
| Thickness (mm) | 1.2 |
| Width (mm) | 10 |
Resources for RMLV0808BGSB
Description
The RMLV0808BGSB is an 8-Mbit static RAM organized as 1, 048, 576-word × 8-bit, fabricated by Renesas' high-performance Advanced LPSRAM technologies. The RMLV0808BGSB realizes higher density, higher performance, and low-power consumption. The device offers low-power standby power dissipation. Therefore, it is suitable for battery backup systems. It is offered in a 44-pin TSOP (II) package.