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1.1G-BIT Low Latency DRAM-III Common I/O Burst Length of 4

Package Information

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Pkg. Type:
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Pkg. Dimensions (mm):
Pitch (mm):

Environmental & Export Classifications

RoHS (RMHE41A184AGBG-120#AC0)EnglishJapanese
Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
ECCN (US)
HTS (US)

Product Attributes

ArchitectureLow Latency DRAM-III
Burst Length (Words)4
Data Width (bits)18000
Density (Kb)1100000
Frequency (Max) (MHz)800
I/O Voltage (V)1 - 1
Lead CompliantNo
MIN Frequency (MHz)400
MOQ1
Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
Supply Voltage (V)1.5 - 1.5
Tape & ReelNo
tRC (ns)13.75

Description

The RMHE41A184AGBG is a 67, 108, 864-word by 18-bit and the RMHE41A364AGBG is a 33, 554, 432-word by 36-bit synchronous double data rate Low Latency RAM fabricated with advanced CMOS technology using DRAM memory cell. The Low Latency DRAM-III chip is a 1. 1Gb DRAM capable of a sustained throughput of approximately 57. 6 Gbps for burst length of 4 (approximately 51. 2 Gbps for applications implementing error correction), excluding refresh overhead and data bus turn-around With a bus speed of 800 MHz, a burst length of 4, and a tRC of 13. 75 ns, the Low Latency DRAM-III chip is capable of achieving this rate when accesses to at least 6 banks of memory are overlapped. These products are packaged in 180-pin FCBGA.