Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | WAFER |
| Pkg. Code: | DICEW |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 0.0 x 0.0 x 0.0 |
| Pitch (mm): |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
Product Attributes
| Pkg. Type | WAFER |
| Lead Count (#) | 0 |
| Carrier Type | WFP |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Temp. Range (°C) | -5 to 95°C |
| Country of Wafer Fabrication | UNITED STATES |
| Application | 800G and beyond advanced multi-level QAM modulation systems |
| Channels (#) | 4 |
| Data Rate Max (Gbps) | 128 |
| Function | Linear Driver |
| MOQ | 70 |
| Output Type | Differential |
| Output Voltage (V) | 2.5V |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
| Price (USD) | $434.341 |
| Published | No |
| Qty. per Carrier (#) | 0 |
| Qty. per Reel (#) | 0 |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Tape & Reel | No |
Resources for RG8G7147A
Description
The RG8G7147A is a low-power, high-performance, 128Gbaud quad-channel linear driver chip designed for 800Gbps and beyond optical integrated transmitter small form factor (SFF) modules for metro and long-haul applications.
The RG8G7147A integrates analog control and digital (through an SPI interface) control circuitry for precise, independent driving level control and monitoring. Each driver channel has a 100Ω differential AC-coupled input and 60Ω differential interface with an open-collector type output stage, suitable for InP-based and silicon photonics-based Mach-Zehnder modulators.