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| CAD Model: | View CAD Model |
| Pkg. Type: | μSO8-FL |
| Pkg. Code: | |
| Lead Count (#): | 8 |
| Pkg. Dimensions (mm): | 3.30 x 3.50 x 0.85 |
| Pitch (mm): |
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
| Pkg. Type | μSO8-FL |
| Lead Count (#) | 8 |
| Carrier Type | Embossed Tape |
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| Channels (#) | 1 |
| Ciss (Typical) (pF) | 930 |
| Function | Power MOSFETs |
| Gate Level | Standard |
| ID (A) | 20 |
| Id max @ 25°C (A) | 20 |
| Lead Compliant | No |
| MOQ | 3000 |
| Mounting Type | Surface Mount |
| Nch/Pch | Nch |
| Pch (W) | 37 |
| Pkg. Dimensions (mm) | 3.30 x 3.50 x 0.85 |
| Qg typ (nC) | 16 |
| Qualification Level | Automotive |
| RDS (ON) (Max) @10V or 8V (mohm) | 21 |
| RDS (ON) (Typical) @ 10V / 8V (mohm) | 18.1 |
| Series Name | REXFET-1 |
| Standard Pkg. Type | μSO8-FL 3x3 BSC |
| Tape & Reel | No |
| VDSS (Max) (V) | 100 |
| VGSS (V) | 20 |
| Vgs (off) (Max) (V) | 4 |
The RBA20N10EANS-5UA21 N-channel power MOSFET features REXFET-1 split-gate technology and is offered in a 3x3 μSO8-FL package. The ultra-compact package is approximately 90% smaller than the traditional DPAK, helping reduce board space and enhance design flexibility. Additionally, it uses Wettable Flank leads that provide excellent solderability and support reliable optical inspection.
Renesas' REXFET-1 split-gate technology is well-suited for applications that require low RDS(on) and switching capability, making it ideal for high-power and high-frequency applications.