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1GHz Arm Cortex-M85 and Ethos-U55 NPU Based AI Microcontroller

Package Information

CAD Model:View CAD Model
Pkg. Type:LFBGA
Pkg. Code:pkg_20159
Lead Count (#):289
Pkg. Dimensions (mm):12 x 12 x 1.38
Pitch (mm):0.65

Environmental & Export Classifications

Moisture Sensitivity Level (MSL)3
ECCN (US)3A991.a.2
HTS (US)8542.31.0025
RoHS (R7KA8P1KFLCAC#UC0)EnglishJapanese
Pb (Lead) FreeYes

Product Attributes

Carrier TypeBulk (Tray)
Family NameRA
Series NameRA8
Group NameRA8P1
CPU ArchitectureArm
Main CPUArm Cortex-M85
Sub CPUYes
Floating Point UnitDouble/Single/Half
Bit Length32
Program Memory (KB)1024
Data Flash (KB)0
RAM (KB)2048KB
ECC SRAMYes
Lead Count (#)289
Pkg. TypeBGA
Pitch (mm)0.65
Pkg. Dimensions (mm)12 x 12 x 1.38
Number of Supply Voltage(s) (#)1
Supply Voltage (V)1.62 - 3.63
I/O Ports199
DMAC or DTCDMAC&DTC
DMA (ch)16
Temperature Sensor (ch) (#)1
Power-On ResetYes
Watchdog Timer (ch)3
External Memory Bus (bit)16,32
DRAM I/FSDRAM
3D GPUNo
AcceleratorNPU
MOQ189
Temp. Range (°C)Tj = 0 to +95
External Interrupt Pins (#)32
LVD or PVDYes
Operating Freq (Max) (MHz)1000
Operating Freq of Sub CPU (Max)250
Sub-clock (32.768 kHz)Yes
On-chip OscillatorYes
Ethernet speed10M/100M/1G
Ethernet (ch)2
EtherCat (ch) (#)0
USB Ports (#)2
USB FS (host ch/device ch)( 1 / 1 )
USB HS (host ch/device ch)( 1 / 1 )
USB SS (host ch/device ch)( 0 / 0 )
PCI Express (generation and ch)No
SCI or UART (ch)10
SPI (ch)2
QSPI (ch)0
OSPI (ch)2
I2C (#)3
I3C (ch)1
CAN (ch)0
CAN-FD (ch)2
WirelessNo
IrDANo
LIN (#)0
SDHI (ch)2
High Resolution Output TimerYes
PWM Output (pin#)28
32-Bit Timer (ch)16
16-Bit Timer (ch) (#)0
8-Bit Timer (ch)0
Standby operable timerYes
Asynchronous General Purpose Timer / Interval Timer (ch)2
RTCYes
16-Bit A/D Converter (ch)30
14-Bit A/D Converter (ch)0
12-Bit A/D Converter (ch)0
10-Bit A/D Converter (ch)0
24-Bit Sigma-Delta A/D Converter (ch)0
16-Bit D/A Converter (ch)0
12-Bit D/A Converter (ch)2
10-Bit D/A Converter (ch) (#)0
8-Bit D/A Converter (ch)0
Analog Comparator (ch)4
OPAMP (ch) (#)0
PGA (ch)0
Capacitive Touch Sensing Unit (ch)0
Graphics LCD ControllerRGB888
MIPI Interfaces (DSI) (ch)1
MIPI Interfaces (CSI) (ch)1
Camera I/F (Parallel)16-bit
Image CodecNo
2D Drawing EngineYes
Segment LCD ControllerNo
SSI (ch)2
Security & Encryption128-bit Unique ID, TRNG, AES(128/192/256), CHA-CHA20, SHA2, SHA3, ECC, Ed25519, RSA-4K, HMAC, GHASH, Wrapped Keys, DLM, SPA/DPA Protection, Tamper Detection, Arm TrustZone
Debug InterfaceJTAG/SWD
Moisture Sensitivity Level (MSL)3
Lead CompliantYes
Length (mm)12
Pb (Lead) FreeYes
Price (USD)$18.26368
Suggested KitsEK-RA8P1
Tape & ReelNo
Thickness (mm)1.38
Width (mm)12

Description

The RA8P1 group features Renesas’s first 32-bit AI-accelerated microcontrollers (MCUs) powered by the high-performance Arm® Cortex®-M85 (CM85) with Helium™ MVE and Ethos™-U55 NPU. It delivers 256GOPS* of AI performance, a breakthrough CPU performance of over 7300 CoreMarks and advanced artificial intelligence (AI) capabilities enabling voice, vision, and real-time analytics AI applications on a single chip. The RA8P1 MCUs built on the advanced 22nm ULL process are available in single and dual-core options with a Cortex-M33 core embedded on the dual-core MCUs.

The RA8P1 MCUs integrate high-performance CPU cores with large memory, multiple external memory interfaces, and a rich peripheral set optimized for AI applications. Single and dual-core devices in 224 and 289 BGA packages are available, to address diverse use cases across broad markets. Secure Element-like functionality is built-in with advanced cryptographic security IP, immutable storage, and tamper protection, to deliver truly secure Edge AI and IoT applications.

To streamline and accelerate development, the RA8P1 MCUs are supported by the Flexible Software Package, a comprehensive set of hardware and software development tools, and RUHMI - a highly optimized AI software platform providing all necessary tools for AI development, model optimization, and conversion, fully integrated with e2 studio.

*Giga Operations Per Second