Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | LFBGA |
| Pkg. Code: | pkg_20159 |
| Lead Count (#): | 289 |
| Pkg. Dimensions (mm): | 12 x 12 x 1.38 |
| Pitch (mm): | 0.65 |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | 3 |
| RoHS (R7KA8D2JFDCAC#UC1) | EnglishJapanese |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| Carrier Type | Full Tray (Tray) |
| Family Name | RA |
| Series Name | RA8 |
| Group Name | RA8D2 |
| CPU Architecture | Arm |
| Main CPU | Arm Cortex-M85 |
| Sub CPU | Yes |
| Floating Point Unit | Double/Single/Half |
| Bit Length | 32 |
| Program Memory (KB) | 1024 |
| Data Flash (KB) | 0 |
| RAM (KB) | 2048 |
| ECC SRAM | Yes |
| Lead Count (#) | 289 |
| Pitch (mm) | 0.65 |
| Pkg. Dimensions (mm) | 12 x 12 x 1.38 |
| Number of Supply Voltage(s) (#) | 1 |
| Supply Voltage (V) | 1.62 - 3.6 |
| I/O Ports | 208 |
| DMAC or DTC | DMAC&DTC |
| DMA (ch) | 16 |
| Temperature Sensor (ch) (#) | 1 |
| Power-On Reset | Yes |
| Watchdog Timer (ch) | 3 |
| External Memory Bus (bit) | 16,32 |
| DRAM I/F | SDRAM |
| 3D GPU | No |
| Accelerator | No |
| Temp. Range (°C) | Tj = -40 to +105 |
| External Interrupt Pins (#) | 32 |
| LVD or PVD | Yes |
| Operating Freq (Max) (MHz) | 800 |
| Operating Freq of Sub CPU (Max) | 200 |
| Sub-clock (32.768 kHz) | Yes |
| On-chip Oscillator | Yes |
| Ethernet speed | 10M/100M/1G |
| Ethernet (ch) | 2 |
| EtherCat (ch) (#) | 0 |
| USB Ports (#) | 2 |
| USB FS (host ch/device ch) | ( 1 / 1 ) |
| USB HS (host ch/device ch) | ( 1 / 1 ) |
| USB SS (host ch/device ch) | ( 0 / 0 ) |
| PCI Express (generation and ch) | No |
| SCI or UART (ch) | 10 |
| SPI (ch) | 2 |
| QSPI (ch) | 0 |
| OSPI (ch) | 2 |
| I2C (#) | 3 |
| I3C (ch) | 1 |
| CAN (ch) | 0 |
| CAN-FD (ch) | 2 |
| Wireless | No |
| IrDA | No |
| LIN (#) | 0 |
| SDHI (ch) | 2 |
| High Resolution Output Timer | Yes |
| PWM Output (pin#) | 28 |
| 32-Bit Timer (ch) | 16 |
| 16-Bit Timer (ch) (#) | 0 |
| 8-Bit Timer (ch) | 0 |
| Standby operable timer | Yes |
| Asynchronous General Purpose Timer / Interval Timer (ch) | 2 |
| RTC | Yes |
| 16-Bit A/D Converter (ch) | 30 |
| 14-Bit A/D Converter (ch) | 0 |
| 12-Bit A/D Converter (ch) | 0 |
| 10-Bit A/D Converter (ch) | 0 |
| 24-Bit Sigma-Delta A/D Converter (ch) | 0 |
| 16-Bit D/A Converter (ch) | 0 |
| 12-Bit D/A Converter (ch) | 2 |
| 10-Bit D/A Converter (ch) (#) | 0 |
| 8-Bit D/A Converter (ch) | 0 |
| Analog Comparator (ch) | 4 |
| OPAMP (ch) (#) | 0 |
| PGA (ch) | 0 |
| Capacitive Touch Sensing Unit (ch) | 0 |
| Graphics LCD Controller | RGB888 |
| MIPI Interfaces (DSI) (ch) | 0 |
| MIPI Interfaces (CSI) (ch) | 0 |
| Camera I/F (Parallel) | 16-bit |
| Image Codec | No |
| 2D Drawing Engine | Yes |
| Segment LCD Controller | No |
| SSI (ch) | 2 |
| Security & Encryption | Unique ID, TRNG, AES(128/192/256), CHA-CHA20, SHA2, SHA3, ECC, Ed25519, RSA-4K, HMAC, GHASH, Wrapped Keys, DLM, SPA/DPA Protection, Tamper Detection, Arm TrustZone |
| Debug Interface | JTAG/SWD |
| Moisture Sensitivity Level (MSL) | 3 |
| Family Name | RA |
| Group Name | RA8D2 |
| Lead Compliant | Yes |
| Length (mm) | 12 |
| MOQ | 189 |
| NPU | No |
| Pb (Lead) Free | Yes |
| Pkg. Type | LFBGA |
| Suggested Kits | EK-RA8D2 |
| Tape & Reel | No |
| Thickness (mm) | 1.38 |
| Width (mm) | 12 |
Resources for RA8D2
Description
The Renesas RA8D2 group comprises 32-bit single and dual-core graphics-enabled MCUs with 1GHz Arm® Cortex®-M85 with Helium™ Vector Extensions and 250MHz Cortex-M33 cores. These MCUs deliver ultra-high performance of over 7300 CoreMark and superior graphics capabilities that enable high-resolution TFT-LCD displays up to WXGA, and vision AI applications.
Integrating the high-performance cores with large on-chip memory, multiple high-throughput memory interfaces, and a rich set of graphics peripherals – a high-resolution LCD controller with parallel RGB and MIPI DSI interfaces, 2D drawing engine, 16-bit parallel CEU, and MIPI CSI-2 camera interfaces – the RA8D2 MCUs address the needs of demanding graphics/HMI and AI applications. Built on the advanced 22nm ULL TSMC process, these devices offer significantly lower active currents and have several low-power features developed to reduce the overall power consumption, while still providing high performance. The RA8D2 MCUs are available in 224, 289, and 303 BGA packages. Secure Element-like functionality is built-in with new cryptographic security IP, secure boot, immutable storage, and tamper protection, enabling truly secure consumer/IoT applications.
The RA8D2 MCUs are fully supported by the Flexible Software Package and a comprehensive set of hardware and software development tools.