| CAD Model: | View CAD Model |
| Pkg. Type: | QFP |
| Pkg. Code: | pkg_1063 |
| Lead Count (#): | 100 |
| Pkg. Dimensions (mm): | 20 x 14 x 3.05 |
| Pitch (mm): | 0.65 |
| RoHS (R5F2L3A7CDFA#U1) | EnglishJapanese |
| Moisture Sensitivity Level (MSL) | |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
| RAM (KB) | 6 |
| Lead Count (#) | 100 |
| Temp. Range (°C) | -40 to +85 |
| ADC | 8-bit x 20-ch, 10-bit x 20-ch |
| Bit Size | 16 |
| CPU | R8C |
| DAC | 8-bit x 2-ch |
| DMA | No |
| Data Flash (KB) | 4 |
| Ethernet | No |
| Family Name | R8C |
| Human Machine Interface | LCD Segment Count x 416 |
| I/O Ports | 88 |
| LVD or PVD | Yes |
| Lead Compliant | Yes |
| Length (mm) | 20 |
| MOQ | 1 |
| Operating Freq (Max) (MHz) | 20 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 20 x 14 x 3.05 |
| Pkg. Type | QFP |
| Program Memory (KB) | 48 |
| RTC | Yes |
| Supply Voltage (V) | 1.8 - 5.5 |
| Tape & Reel | No |
| Thickness (mm) | 3.05 |
| Timer | 8-bit x 3-ch, 16-bit x 4-ch |
| Width (mm) | 14 |
The R8C/L3AC Group is supported only for customers who have already adopted these products. The RL78/L1C Group is recommended for new designs.
The R8C/L35M Group, R8C/L36M Group, R8C/L38M Group, and R8C/L3AM Group of single-chip MCUs incorporate the R8C CPU core, which implements a powerful instruction set for a high level of efficiency and supports a 1Mb address space, allowing execution of instructions at high speed. In addition, the CPU core integrates a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, helps reduce the number of system components. These groups have data flash (1KB × 4 blocks) with the background operation (BGO) function.