Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | LQFP |
| Pkg. Code: | pkg_712 |
| Lead Count (#): | 52 |
| Pkg. Dimensions (mm): | 10 x 10 x 1.7 |
| Pitch (mm): |
Environmental & Export Classifications
| RoHS (R5F2L357ANFP#V2) | EnglishJapanese |
| Moisture Sensitivity Level (MSL) | |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| ADC | 10-bit x 10-ch |
| Bit Size | 16 |
| CPU | R8C |
| DAC | 8-bit x 2-ch |
| DMA | No |
| Data Flash (KB) | 4 |
| Ethernet | No |
| Family Name | R8C |
| LVD or PVD | No |
| Lead Compliant | Yes |
| Lead Count (#) | 52 |
| Length (mm) | 10 |
| MOQ | 1 |
| Operating Freq (Max) (MHz) | 20 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 10 x 10 x 1.7 |
| Pkg. Type | LQFP |
| RTC | Yes |
| Tape & Reel | No |
| Temp. Range (°C) | -20 to +85 |
| Thickness (mm) | 1.7 |
| Timer | 8-bit x 3-ch, 16-bit x 4-ch |
| Width (mm) | 10 |
Resources for R8C/L35A
Description
The R8C/L35A, R8C/L35B Group is supported only for customers who have already adopted these products. The RL78/L12, L13 Groups are recommended for new designs.
The R8C/56E Group, R8C/56F Group, R8C/56G Group, R8C/56H Group of single-chip microcontrollers (MCUs) incorporate the R8C CPU core, which provides sophisticated instructions for a high level of efficiency. With 1Mb of address space, the CPU core is capable of executing instructions at high speed. In addition, it features a multiplier for high-speed arithmetic processing.
Power consumption is low, and additional power control is possible by selecting the operating mode. The R8C/56E Group, R8C/56F Group, R8C/56G Group, R8C/56H Group are also designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface on the same chip, reduces the number of system components. The R8C/56E Group and R8C/56F Group incorporate one channel of CAN module, ideal for the LAN systems of automotive and factory automation applications. The R8C/56G Group and R8C/56H Group do not incorporate the CAN module. The R8C/56E Group and R8C/56G Group also have on-chip data flash (1KB × 4 blocks) with background operation (BGO) function.