Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | HWQFN |
| Pkg. Code: | pkg_1204 |
| Lead Count (#): | 24 |
| Pkg. Dimensions (mm): | 4 x 4 x 0.8 |
| Pitch (mm): |
Environmental & Export Classifications
| RoHS (R5F213G6MNNP#U0) | EnglishJapanese |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| Carrier Type | Tape & Reel |
| Country of Assembly | JAPAN |
| Country of Wafer Fabrication | JAPAN |
| ADC | 10-bit x 8-ch |
| Bit Size | 16 |
| CPU | R8C |
| DAC | 8-bit x 2-ch |
| DMA | Yes |
| Data Flash (KB) | 4 |
| Ethernet | No |
| Family Name | R8C |
| I/O Ports | 19 |
| LVD or PVD | Yes |
| Lead Compliant | Yes |
| Lead Count (#) | 24 |
| Length (mm) | 4 |
| MOQ | 1 |
| Moisture Sensitivity Level (MSL) | 3 |
| Operating Freq (Max) (MHz) | 20 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 4 x 4 x 0.8 |
| Pkg. Type | HWQFN |
| Program Memory (KB) | 32 |
| RAM (KB) | 2.5 |
| RTC | Yes |
| Supply Voltage (V) | 1.8 - 5.5 |
| Tape & Reel | No |
| Temp. Range (°C) | -20 to +85 |
| Thickness (mm) | 0.8 |
| Timer | 8-bit x 3-ch, 16-bit x 1-ch |
| Width (mm) | 4 |
Resources for R8C/3GM
Description
The R8C/3GM Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency.
The R8C/3GM Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. The R8C/3GM Group has data flash (1KB × 4 blocks) with the background operation (BGO) function.