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16-bit Microcontrollers with R8C CPU Core (Non Promotion)

Package Information

CAD Model:View CAD Model
Pkg. Type:LQFP
Pkg. Code:pkg_7475
Lead Count (#):32
Pkg. Dimensions (mm):7 x 7 x 1.7
Pitch (mm):0.8

Environmental & Export Classifications

RoHS (R5F21335CDFP#50)EnglishJapanese
Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
ECCN (US)
HTS (US)

Product Attributes

RAM (KB)2
Lead Count (#)32
Temp. Range (°C)-40 to +85
ADC10-bit x 12-ch
Bit Size16
CPUR8C
DAC8-bit x 2-ch
DMANo
Data Flash (KB)4
EthernetNo
Family NameR8C
I/O Ports27
LVD or PVDYes
Lead CompliantYes
Length (mm)7
MOQ1000
Moisture Sensitivity Level (MSL)3
Operating Freq (Max) (MHz)20
Pb (Lead) FreeYes
Pkg. Dimensions (mm)7 x 7 x 1.7
Pkg. TypeLQFP
Program Memory (KB)24
RTCYes
Replacement ProductR5F21335CDFP#51
Replacement RemarkTape & reel packing change for R8C/3x by PCN(EP2O-AC-24-0030)
Supply Voltage (V)1.8 - 5.5
Tape & ReelNo
Thickness (mm)1.7
Timer8-bit x 3-ch, 16-bit x 1-ch
Width (mm)7

Description

The R8C/33C Group is supported only for customers who have already adopted these products.

The R8C/33C Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.

Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. The R8C/33C Group has data flash (1KB × 4 blocks) with the background operation (BGO) function.