Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | LSSOP |
| Pkg. Code: | pkg_447 |
| Lead Count (#): | 20 |
| Pkg. Dimensions (mm): | 6.5 x 4.4 x 1.45 |
| Pitch (mm): | 0.65 |
Environmental & Export Classifications
| RoHS (R5F212H1SDSP#W4) | EnglishJapanese |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| Carrier Type | Embossed Tape |
| Bit Size | 16 |
| CPU | R8C |
| DMA | No |
| Data Flash (KB) | 0 |
| Ethernet | No |
| Family Name | R8C |
| I/O Ports | 15 |
| LVD or PVD | Yes |
| Lead Compliant | Yes |
| Lead Count (#) | 20 |
| Length (mm) | 6 |
| MOQ | 2500 |
| Moisture Sensitivity Level (MSL) | 3 |
| Operating Freq (Max) (MHz) | 8 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 6 x 4 x 1.45 |
| Pkg. Type | LSSOP |
| Program Memory (KB) | 4 |
| RAM (KB) | 0.25 |
| RTC | Yes |
| Supply Voltage (V) | 2.2 - 5.5 |
| Tape & Reel | No |
| Temp. Range (°C) | -40 to +85 |
| Thickness (mm) | 1.45 |
| Timer | 8-bit x 3-ch, 16-bit x 1-ch |
| Width (mm) | 4 |
Resources for R8C/2H
Description
The R8C/2H Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.
The R8C/2G Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs also use an anti-noise configuration to reduce emissions of electromagnetic noise and are designed to withstand EMI. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components.