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16-bit Microcontrollers with R8C CPU Core (Non Promotion)

Package Information

CAD Model:View CAD Model
Pkg. Type:LQFP
Pkg. Code:pkg_8426
Lead Count (#):64
Pkg. Dimensions (mm):14 x 14 x 1.7
Pitch (mm):0.8

Environmental & Export Classifications

RoHS (R5F212A7SNFA#V2)EnglishJapanese
Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
ECCN (US)
HTS (US)

Product Attributes

RAM (KB)2.5
Lead Count (#)64
Temp. Range (°C)-20 to +85
Country of AssemblyCHINA
Country of Wafer FabricationJAPAN
ADC10-bit x 12-ch
Bit Size16
CPUR8C
Carrier TypeTray
DAC8-bit x 2-ch
DMANo
Data Flash (KB)0
EthernetNo
Family NameR8C
I/O Ports55
LVD or PVDYes
Lead CompliantYes
Length (mm)14
MOQ1
Moisture Sensitivity Level (MSL)3
Operating Freq (Max) (MHz)20
Pb (Lead) FreeYes
Pkg. Dimensions (mm)14 x 14 x 1.7
Pkg. TypeLQFP
Price (USD)$7.10289
Program Memory (KB)48
RTCYes
Supply Voltage (V)2.2 - 5.5
Tape & ReelNo
Thickness (mm)1.7
Timer8-bit x 3-ch, 16-bit x 4-ch
Width (mm)14

Description

The R8C/2A Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.

These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip data flash (1KB × 2 blocks). The difference between the R8C/28 Group and R8C/29 Group is only the presence or absence of data flash. Their peripheral functions are the same.