Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | TFLGA |
| Pkg. Code: | pkg_677 |
| Lead Count (#): | 64 |
| Pkg. Dimensions (mm): | 6 x 6 x 1.05 |
| Pitch (mm): |
Environmental & Export Classifications
| RoHS (R5F21254SNLG#U0) | EnglishJapanese |
| Moisture Sensitivity Level (MSL) | |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| RAM (KB) | 1 |
| Lead Count (#) | 64 |
| Temp. Range (°C) | -20 to +85 |
| ADC | 10-bit x 12-ch |
| Bit Size | 16 |
| CPU | R8C |
| Carrier Type | Tray |
| DMA | No |
| Data Flash (KB) | 2 |
| Ethernet | No |
| Family Name | R8C |
| I/O Ports | 41 |
| LVD or PVD | Yes |
| Lead Compliant | Yes |
| Length (mm) | 6 |
| MOQ | 1 |
| Operating Freq (Max) (MHz) | 20 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 6 x 6 x 1.05 |
| Pkg. Type | TFLGA |
| Program Memory (KB) | 16 |
| RTC | Yes |
| Supply Voltage (V) | 2.2 - 5.5 |
| Tape & Reel | No |
| Thickness (mm) | 1.05 |
| Timer | 8-bit x 3-ch, 16-bit x 2-ch |
| Width (mm) | 6 |
Resources for R8C/25
Description
The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.
These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/25 Group has on-chip data flash (1KB x 2 blocks). The difference between the R8C/24 Group and R8C/25 Group is only the presence or absence of data flash. Their peripheral functions are the same.