Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | LSSOP |
| Pkg. Code: | pkg_447 |
| Lead Count (#): | 20 |
| Pkg. Dimensions (mm): | 6.5 x 4.4 x 1.45 |
| Pitch (mm): | 0.65 |
Environmental & Export Classifications
| RoHS (R5F21183DSP#W4) | EnglishJapanese |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| RAM (KB) | 0.75 |
| Lead Count (#) | 20 |
| Temp. Range (°C) | -40 to +85 |
| Bit Size | 16 |
| CPU | R8C |
| Carrier Type | Embossed Tape |
| DMA | No |
| Data Flash (KB) | 0 |
| Ethernet | No |
| Family Name | R8C |
| I/O Ports | 13 |
| LVD or PVD | Yes |
| Lead Compliant | Yes |
| Length (mm) | 6 |
| MOQ | 2500 |
| Moisture Sensitivity Level (MSL) | 3 |
| Operating Freq (Max) (MHz) | 20 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 6 x 4 x 1.45 |
| Pkg. Type | LSSOP |
| Program Memory (KB) | 12 |
| RTC | No |
| Supply Voltage (V) | 2.7 - 5.5 |
| Tape & Reel | No |
| Thickness (mm) | 1.45 |
| Timer | 8-bit x 2-ch, 16-bit x 1-ch |
| Width (mm) | 4 |
Resources for R8C/18
Description
The R8C/18 Group is supported only for customers who have already adopted these products. The RL78/G12 Group is recommended for new designs.
This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 20-pin plastic molded LSSOP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. Furthermore, the data flash ROM (1KB × 2 blocks) is embedded in the R8C/17 group. The difference between the R8C/16 and R8C/17 groups is only the existence of the data flash ROM. Their peripheral functions are the same.