Skip to main content
R-Car H3N/H3Ne/H3Ne-1.7G High-end Automotive System-on-Chip (SoC) for In-vehicle Infotainment and Integrated Cockpit

Package Information

CAD Model:View CAD Model
Pkg. Type:BGA
Pkg. Code:
Lead Count (#):1022
Pkg. Dimensions (mm):
Pitch (mm):

Environmental & Export Classifications

ECCN (US)3A991.a.2
HTS (US)8542.31.0070
Pb (Lead) Free
Moisture Sensitivity Level (MSL)

Product Attributes

Lead Count (#)1022
3D GPUGX6650, D/AVE-HD
AcceleratorIMR
Application Core4x Cortex A57, 4x Cortex A53
Audio CodecYes
Auto I/F2x CAN 2.0B, 2x CAN FD
Computer Vision / FrequencyNo
DDR Interface2x 32-bit LPDDR4-3200
Deep Learning (TOPS)No
Ethernet1x Gbit Standart Port
Flash InterfaceParallel Serial Flash Raw NAND, 2x eMMC 4x SDIO
High Speed2x PCIe SATA
Highest ASIL LevelQM, Up to ASIL B
Key Features11x UART, 4x SPI, 7x I2C, USB, MOST, Security, JTAG
Parametric ApplicationsCockpit/IVI
Pkg. TypeBGA
Real Time Core Freq / KDMIPSCortex R7
Temp. Range (°C)-40 to +85°C
Video CodecVideo HW codec
Video Input2x Digital 2x MIPI-CSI2
Video OutputDigital Out LVDS HDMI

Description

The R-Car H3Ne is a scale down of H3e, with similar positioning. It has more narrow data throughput and some peripherals optimized out. Its applications are broad, including for example In-Vehicle Infotainment systems and Integrated Cockpit. It is compliant with the ISO 26262 (ASIL-B) functionality safety standard for automotive and has enhanced security functions.