Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | BFG |
| Pkg. Code: | |
| Lead Count (#): | 401 |
| Pkg. Dimensions (mm): | |
| Pitch (mm): |
Environmental & Export Classifications
| ECCN (US) | 3A991.a.2 |
| HTS (US) | 8542.31.0070 |
| Pb (Lead) Free | |
| Moisture Sensitivity Level (MSL) |
Product Attributes
| Lead Count (#) | 401 |
| 3D GPU | GE8300, D/AVE-HD |
| Accelerator | IMR |
| Application Core | 1x Cortex A53 |
| Audio Codec | Yes |
| Auto I/F | 2x CAN 2.0B, 2x CAN FD |
| CPU | Cortex-A53 x 1 |
| Computer Vision / Frequency | No |
| DDR Interface | 1x 16-bit DDR3(L)-1866 |
| Deep Learning (TOPS) | No |
| Ethernet | 1x Gbit Standart Port |
| Flash Interface | Raw NAND, Serial Flash 1x eMMC |
| High Speed | - |
| Highest ASIL Level | QM |
| Key Features | 8x UART, 4x SPI, 4x I2C, USB, MOST, Security, JTAG |
| Parametric Applications | Cluster |
| Pkg. Type | BFG |
| Real Time Core Freq / KDMIPS | No |
| Temp. Range (°C) | -40 to +105°C |
| Video Codec | Video HW codec |
| Video Input | 1x Digital |
| Video Output | Dig. Out / LVDS LVDS |
Resources for R-Car-D3e
Description
Currently, the development for autonomous driving has progressed and the number of connections between the instrument cluster and various sensors, information, and control devices are increasing. This is leading to an increasing amount of information being displayed on the instrument cluster to realize, including information on the vicinity of the car during driving. At the same time, from the point of view of safety, the need for increased visibility is increasing, and it is necessary to render graphics smoothly. Also, due to advances in LCD display technology, the trends towards larger sizes, higher resolution, and lower costs in automotive LCD displays are progressing. As a result, 3D clusters are becoming more widely used in the instrument cluster field.
Renesas has released the R-Car D3e automotive system SoC to address smooth rendering of high-quality 3D graphics and reduce development steps and costs, which are challenges for the development of entry-class 3D clusters.