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R-Car D3/D3e Automotive System-on-Chip (SoC) for 3D Graphics Cluster

Package Information

CAD Model:View CAD Model
Pkg. Type:BFG
Pkg. Code:
Lead Count (#):401
Pkg. Dimensions (mm):
Pitch (mm):

Environmental & Export Classifications

ECCN (US)3A991.a.2
HTS (US)8542.31.0070
Pb (Lead) Free
Moisture Sensitivity Level (MSL)

Product Attributes

Lead Count (#)401
3D GPUGE8300, D/AVE-HD
AcceleratorIMR
Application Core1x Cortex A53
Audio CodecYes
Auto I/F2x CAN 2.0B, 2x CAN FD
CPUCortex-A53 x 1
Computer Vision / FrequencyNo
DDR Interface1x 16-bit DDR3(L)-1866
Deep Learning (TOPS)No
Ethernet1x Gbit Standart Port
Flash InterfaceRaw NAND, Serial Flash 1x eMMC
High Speed-
Highest ASIL LevelQM
Key Features8x UART, 4x SPI, 4x I2C, USB, MOST, Security, JTAG
Parametric ApplicationsCluster
Pkg. TypeBFG
Real Time Core Freq / KDMIPSNo
Temp. Range (°C)-40 to +105°C
Video CodecVideo HW codec
Video Input1x Digital
Video OutputDig. Out / LVDS LVDS

Description

Currently, the development for autonomous driving has progressed and the number of connections between the instrument cluster and various sensors, information, and control devices are increasing. This is leading to an increasing amount of information being displayed on the instrument cluster to realize, including information on the vicinity of the car during driving. At the same time, from the point of view of safety, the need for increased visibility is increasing, and it is necessary to render graphics smoothly. Also, due to advances in LCD display technology, the trends towards larger sizes, higher resolution, and lower costs in automotive LCD displays are progressing. As a result, 3D clusters are becoming more widely used in the instrument cluster field.
Renesas has released the R-Car D3e automotive system SoC to address smooth rendering of high-quality 3D graphics and reduce development steps and costs, which are challenges for the development of entry-class 3D clusters.