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Mid-power, Multi-protocol NFC Forum Compliant Reader

Package Information

CAD Model:View CAD Model
Pkg. Type:VFQFPN
Pkg. Code:QW0056AA
Lead Count (#):56
Pkg. Dimensions (mm):7.0 x 0.75 x 0.75
Pitch (mm):0.4

Environmental & Export Classifications

Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
ECCN (US)
HTS (US)

Product Attributes

Pkg. TypeVFQFPN
Lead Count (#)56
Carrier TypeReel
Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
ApplicationIoT
Comm. InterfaceSPI, I2C, UART
Country of AssemblyCHINA
Country of Wafer FabricationTAIWAN
Device FunctionsNFC Reader Non-payment and Non-Android
Length (mm)7
Longevity2038 Jul
MOQ3000
Output Power Max (W)1
Pb Free Categorye3 Sn
Pitch (mm)0.4
Pkg. Dimensions (mm)7.0 x 0.75 x 0.75
Price (USD)$4.74
ProtocolISO/IEC 14443 A/B, ISO/IEC 18092, FeliCa™, ISO/IEC 15693
PublishedNo
Qty. per Carrier (#)0
Qty. per Reel (#)3000
Software SupportOS, NON-OS
Tape & ReelYes
Temp. Range (°C)-40 to 85°C
Thickness (mm)0.75
Width (mm)0.75
Wireless StandardNFC Forum Reader/Writer

Description

The PTX105R is a highly optimized NFC controller designed for compact IoT applications. It features superior sensitivity, precise digital sine wave shaping, and a reduced bill of materials compared to traditional square-wave NFC controllers. These advantages enable enhanced interoperability, streamlined FCC certification, and faster NFC Forum compliance.

The PTX105R also supports full end-to-end IoT go-to-market (GTM) integration through its compatibility with the RA microcontroller ecosystem. It is available via hardware modules on the QuickConnect platform and is also supported through the Arduino shield platform, enabling faster prototyping and deployment.

Benefits:

  • Easier to achieve interoperability with the broader set of more demanding NFC device form factors
  • Reliable NFC coupling in challenging operating environments, or with a small form factor antenna
  • Supports operation through an antenna typically 4-5 times smaller than that required by conventional NFC readers
  • Fewer external components for bill-of-materials cost and space savings
  • Comprehensive IoT go-to-market support for accelerated prototyping and deployment