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Dual 15A/Single 30A Step-Down Power Module

Package Information

CAD Model: View CAD Model
Pkg. Type: Module
Pkg. Code: YGJ
Lead Count (#): 26
Pkg. Dimensions (mm): 17.00 x 17.00 x 7.50
Pitch (mm): 1

Environmental & Export Classifications

Moisture Sensitivity Level (MSL) 4
Pb (Lead) Free Exempt
ECCN (US)
HTS (US)

Product Attributes

Lead Count (#) 26
Carrier Type Tray
Moisture Sensitivity Level (MSL) 4
Pb (Lead) Free Exempt
Pb Free Category Pb-Free 100% Matte Tin Plate w/Anneal-e3
Temp. Range (°C) -40 to +125°C
Configuration Normal
Control Type Voltage Mode
Current Sharing Yes
Digital Bus No
Input Voltage (Max) (V) 20
Input Voltage (Min) (V) 4.5
Length (mm) 17
MOQ 650
Output Current (Max) [Rail 1] (A) 30
Output Voltage (Max) (V) 7.5
Output Voltage (Min) (V) 0.6
POR Yes
Parametric Category Analog-Interface Power Modules
Peak Efficiency (%) 95
Pitch (mm) 1
Pkg. Dimensions (mm) 17.0 x 17.0 x 7.50
Pkg. Type Module
Pvin (Max) Internal Linear Reg
Pvin (Min) Internal Linear Reg
Qualification Level Standard
Quiescent Current 131 mA
SYNCH Capability Yes
Simulation Model Available iSim
Switching Frequency Range (Typical) (kHz) 150 - 1500
Thickness (mm) 7.5
Width (mm) 17

Description

The ISL8225M is a fully-encapsulated step-down switching power supply that can deliver up to 100W output power from a small 17mm square PCB footprint. The two 15A outputs may be used independently or combined to deliver a single 30A output. Designing a high-performance board mounted power supply has never been simpler -- only a few external components are needed to create a very dense and reliable power solution. Automatic current sharing and phase interleaving allow up to six modules to be paralleled for 180A output capability. 1. 5% output voltage accuracy, differential remote voltage sensing and fast transient response create a very high-performance power system. Built-in output overvoltage, overcurrent and over-temperature protection enhance system reliability. The ISL8225M is available in a thermally-enhanced QFN package. Excellent efficiency and low thermal resistance permit full power operation without heat sinks or fans. In addition, the QFN package with external leads permits easy probing and visual solder inspection.