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Renesas Electronics Corporation
Dual 15A/Single 30A Step-Down Power Module

Package Information

CAD Model:View CAD Model
Pkg. Type:Module
Pkg. Code:YGJ
Lead Count (#):26
Pkg. Dimensions (mm):17.0 x 17.0 x 7.50
Pitch (mm):1

Environmental & Export Classifications

Moisture Sensitivity Level (MSL)4
Pb (Lead) FreeExempt
ECCN (US)
HTS (US)

Product Attributes

Lead Count (#)26
Carrier TypeTray
Moisture Sensitivity Level (MSL)4
Pb (Lead) FreeExempt
Pb Free CategoryPb-Free 100% Matte Tin Plate w/Anneal-e3
Temp. Range (°C)-40 to +125°C
ConfigurationNormal
Control TypeVoltage Mode
Current SharingYes
Digital BusNo
Input Voltage (Max) (V)20
Input Voltage (Min) (V)4.5
Length (mm)17
MOQ650
Output Current (Max) [Rail 1] (A)30
Output Voltage (Max) (V)7.5
Output Voltage (Min) (V)0.6
PORYes
Parametric CategoryAnalog-Interface Power Modules
Peak Efficiency (%)95
Pitch (mm)1
Pkg. Dimensions (mm)17.0 x 17.0 x 7.50
Pkg. TypeModule
Pvin (Max)Internal Linear Reg
Pvin (Min)Internal Linear Reg
Qualification LevelStandard
Quiescent Current131 mA
SYNCH CapabilityYes
Simulation Model AvailableiSim
Switching Frequency Range (Typical) (kHz)150 - 1500
Thickness (mm)7.5
Width (mm)17

Description

The ISL8225M is a fully-encapsulated step-down switching power supply that can deliver up to 100W output power from a small 17mm square PCB footprint. The two 15A outputs may be used independently or combined to deliver a single 30A output. Designing a high-performance board mounted power supply has never been simpler -- only a few external components are needed to create a very dense and reliable power solution. Automatic current sharing and phase interleaving allow up to six modules to be paralleled for 180A output capability. 1. 5% output voltage accuracy, differential remote voltage sensing and fast transient response create a very high-performance power system. Built-in output overvoltage, overcurrent and over-temperature protection enhance system reliability. The ISL8225M is available in a thermally-enhanced QFN package. Excellent efficiency and low thermal resistance permit full power operation without heat sinks or fans. In addition, the QFN package with external leads permits easy probing and visual solder inspection.