Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | Module |
| Pkg. Code: | YGG |
| Lead Count (#): | 22 |
| Pkg. Dimensions (mm): | 15.00 x 15.00 x 3.60 |
| Pitch (mm): | 1 |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Exempt |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| Lead Count (#) | 22 |
| Carrier Type | Tray |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Exempt |
| Pb Free Category | Nickel/Palladium/Gold-e4 |
| Temp. Range (°C) | -40 to +85°C |
| Configuration | Normal |
| Control Type | Voltage Mode |
| Current Sharing | No |
| Digital Bus | No |
| Input Voltage (Max) (V) | 80 |
| Input Voltage (Min) (V) | 10 |
| Length (mm) | 15 |
| MOQ | 96 |
| Output Current (Max) [Rail 1] (A) | 4 |
| Output Voltage (Max) (V) | 30 |
| Output Voltage (Min) (V) | 2.5 |
| POR | Yes |
| Parametric Category | Analog-Interface Power Modules |
| Peak Efficiency (%) | 96 |
| Pitch (mm) | 1 |
| Pkg. Dimensions (mm) | 15.0 x 15.0 x 3.60 |
| Pkg. Type | Module |
| Pvin (Max) | Internal Linear Reg |
| Pvin (Min) | Internal Linear Reg |
| Qualification Level | Standard |
| Quiescent Current | 14 mA |
| SYNCH Capability | Yes |
| Simulation Model Available | iSim |
| Switching Frequency Range (Typical) (kHz) | 100 - 600 |
| Thickness (mm) | 3.6 |
| Width (mm) | 15 |
Resources for ISL8216M
Description
The ISL8216M is a simple and easy to use, high voltage DC/DC module and is ideal for a wide variety of applications. It eliminates design and manufacturing risks while dramatically improving time to market. The simplicity is in the Off-The-Shelf unassisted implementation. All you need is the ISL8216M, input and output capacitors, and one resistor to program the output voltage and you have a complete high voltage power design ready for the market. The ISL8216M is packaged in a thermally enhanced, compact (15mm×15mm×3. 6mm) over-molded High-Density Array (HDA) Package, which permits full load operation without heat sink or fans. The package is suitable for automated assembly by standard surface mount equipment. The small amount of external components reduce the PCB to a component layer and a simple ground layer.