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Radiation Hardened and SEE Hardened 3V to 13.2V, 6A Buck Regulator

Package Information

CAD Model: View CAD Model
Pkg. Type: DIE
Pkg. Code:
Lead Count (#):
Pkg. Dimensions (mm):
Pitch (mm):

Environmental & Export Classifications

Moisture Sensitivity Level (MSL)
Pb (Lead) Free No
RoHS (ISL70003SEHVX) EnglishJapanese
ECCN (US)
HTS (US)

Product Attributes

Pkg. Type DIE
DLA SMD 5962-14203
Pb (Lead) Free No
MOQ 10
Temp. Range (°C) -55 to +125°C
CAGE code 34371
DSEE (MeV·cm2/mg) 86.4
IQ [Rail 1] (µA) 10000
Input Voltage (Max) [Rail 1] (V) 13.2 - 13.2
Input Voltage (Min) [Rail 1] (V) 3
Lead Compliant No
Output Current (Max) [Rail 1] (A) 9
Output Voltage (Max) [Rail 1] (V) 11.88
Outputs (#) 1
Qualification Level Class V
Rating Space
Switching Frequency (MHz) 0.3 - 0.5
TID HDR (krad(Si)) 100
TID LDR (krad(Si)) 100
Tape & Reel No

Description

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The ISL70003SEH is a radiation and SEE hardened synchronous buck regulator capable of operating over an input voltage range of 3. 0V to 13. 2V. With integrated MOSFETs, this highly efficient single chip power solution provides a tightly regulated output voltage that is externally adjustable from 0. 6V to ~90% of the input voltage. Continuous output load current capability is 6A for TJ ≤ +125°C and 3A for TJ ≤ +150°C. The ISL70003SEH uses voltage mode control architecture with feed-forward and switches at a selectable frequency of 500kHz or 300kHz. Loop compensation is externally adjustable to allow for an optimum balance between stability and output dynamic performance. The internal synchronous power switches are optimized for high efficiency and excellent thermal performance. The chip features two logic-level disable inputs that can be used to inhibit pulses on the phase (LXx) pins in order to maximize efficiency based on the load current. The ISL70003SEH also supports DDR applications and contains a buffer amplifier for generating the VREF voltage. High integration, best in class radiation performance and a feature-filled design make the ISL70003SEH an ideal choice to power many of today's small form-factor applications.