Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | TDFN |
| Pkg. Code: | LNM |
| Lead Count (#): | 10 |
| Pkg. Dimensions (mm): | 3.00 x 3.00 x 0.75 |
| Pitch (mm): | 0.5 |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
| RoHS (ISL54211IRTZ-T) | Download |
Product Attributes
| Lead Count (#) | 10 |
| Carrier Type | Reel |
| Moisture Sensitivity Level (MSL) | 1 |
| Pitch (mm) | 0.5 |
| Pkg. Dimensions (mm) | 3.0 x 3.0 x 0.75 |
| Pb (Lead) Free | Yes |
| Pb Free Category | Pb-Free 100% Matte Tin Plate w/Anneal-e3 |
| Temp. Range (°C) | -40 to +85°C |
| Audio Input Range (±V) | 1.5 |
| Audio THD @32Ω (%) | 0.014 |
| BW USB High-Speed (MHz) | 700 |
| Click Pop Circuitry | Yes |
| Configuration | USB/MP3 |
| IS (mA) | 0.007 |
| Length (mm) | 3 |
| MOQ | 6000 |
| Pkg. Type | TDFN |
| Qualification Level | Standard |
| Supply Current Power Down (µA) | 2.4 |
| Supply Voltage Vdd (V) | 5 - 5 |
| Switch Control | Logic Level |
| Thickness (mm) | 0.75 |
| VDD Range (V) (V) | 2.7 - 5 |
| Width (mm) | 3 |
Resources for ISL54211
Description
The ISL54211 dual Single Pole/Double Throw (SPDT) switches combine low distortion audio and accurate USB 2.0 High-Speed data (480Mbps) signal switching in the same low voltage device. When operated with a 2.7V to 5.0V single supply, these analog switches allow audio signal swings below-ground, allowing the use of a common USB and audio headphone connector in personal media players and other portable battery-powered devices. The ISL54211 logic control pins are 1.8V compatible with a supply voltage of 2.7V to 3.6V, which allows for control via a standard microcontroller. The part has an audio enable control pin (CTRL) to open all in-line switches and activate the audio click and pop circuitry. The high off-isolation and special click/pop circuitry of the audio switches eliminate clicks and pops in the headphones when the audio CODEC drivers are powering up or down or when a headphone is inserted or removed from the headphone jack. It's available in a tiny 10 Ld 1.8mm x 1.4mm ultra-thin µTQFN package and a 10 Ld 3mm x 3mm TDFN package. It operates over a temperature range of -40 °C to +85 °C.