| CAD Model: | View CAD Model |
| Pkg. Type: | WAFER |
| Pkg. Code: | DICEW |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 0.0 x 0.0 x 0.0 |
| Pitch (mm): |
| Moisture Sensitivity Level (MSL) | |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
| Pkg. Type | WAFER |
| Carrier Type | WFP |
| Application | 200G Ethernet SR4, 400G Etherenet SR8, QSFP56, QSFP-DD/OSFP |
| Channels (#) | 4 |
| Data Rate Max (Gbps) | 56 |
| Function | CDR / Retimer /Driver |
| Lead Count (#) | 0 |
| MOQ | 100 |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
| Price (USD) | $359.7895 |
| Published | No |
| Qty. per Carrier (#) | 0 |
| Qty. per Reel (#) | 0 |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Tape & Reel | No |
| Temp. Range (°C) | -5 to 95°C |
The HXT14450 is a quad-channel, low power, linear vertical-cavity surface-emitting laser (VCSEL) driver with an integrated clock and data recovery (CDR) unit. The chip is designed for MMF PMD Short-Reach applications that support 200G per port with a signaling rate up to 56Gbps PAM4 modulation. In conjunction with the HXR14450 – a quad-channel transimpedance amplifier (TIA) receiver with an integrated CDR, one can produce compact quad small form factor QSFP-type modules to serve high speed optical interconnects in data center applications.
The HXT14450 has a built-in adaptive linear equalizer and a decision-feedback equalizer (DFE), which can work in chip-to-module and chip-to-chip interconnects. The chipsets provide on-chip testability such as PRBS generator and error checker.
Designed for direct DC-coupled die with VCSEL or on-board optics (OBO) and with a small number of additional components for cost-effective and compact assemblies, this chipset enables lower power and compact modules for high density and high BW application in hyper-scale data center applications.