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8k x 8 CMOS PROM

Package Information

CAD Model: View CAD Model
Pkg. Type: CFP
Pkg. Code: KBR
Lead Count (#): 28
Pkg. Dimensions (mm): 18.29 x 12.70 x 0.00
Pitch (mm): 1.27

Environmental & Export Classifications

Moisture Sensitivity Level (MSL) Not Applicable
Pb (Lead) Free Yes
ECCN (US) 9A515.e.1
HTS (US) 8542.32.0071
RoHS (HS9-6664RH-T) EnglishJapanese

Product Attributes

Pkg. Type CFP
Lead Count (#) 28
Carrier Type Tray
Moisture Sensitivity Level (MSL) Not Applicable
Pitch (mm) 1.3
Pkg. Dimensions (mm) 18.3 x 12.7 x 0.00
DLA SMD 5962R9562601TYC
Pb (Lead) Free Yes
Pb Free Category Gold Plate over compliant Undercoat-e4
MOQ 450
Temp. Range (°C) -55 to +125°C
CAGE code 34371
Lead Compliant No
Length (mm) 18.3
Qualification Level QML Class T (space lower level)
Rating Space
TID HDR (krad(Si)) 100
Tape & Reel No
Width (mm) 12.7

Description

The Intersil Satellite Applications Flow™ (SAF) devices are fully tested and guaranteed to 100kRAD total dose. These QML Class T devices are processed to a standard flow intended to meet the cost and shorter lead-time needs of large volume satellite manufacturers while maintaining a high level of reliability. The Intersil HS-6664RH-T is a radiation hardened 64K CMOS PROM, organized in an 8K word by 8-bit format. The chip is manufactured using a radiation hardened CMOS process and utilizes synchronous circuit design techniques to achieve high-speed performance with very low power dissipation. On-chip address latches are provided, allowing easy interfacing with microprocessors that use a multiplexed address/data bus structure. The output enable control simplifies system interfacing by allowing output data bus control in addition to the chip enable control. All bits are manufactured storing a logical 0 and can be selectively programmed for a logical 1 at any bit location.