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Renesas Electronics Corporation
8k x 8 CMOS PROM

Package Information

CAD Model:View CAD Model
Pkg. Type:SBDIP
Pkg. Code:DKP
Lead Count (#):28
Pkg. Dimensions (mm):35.6 x 15.1 x 2.41
Pitch (mm):2.5

Environmental & Export Classifications

Moisture Sensitivity Level (MSL)Not Applicable
Pb (Lead) FreeYes
ECCN (US)9A515.e.1
HTS (US)8542.32.0071
RoHS (HS1-6664RH-T)EnglishJapanese

Product Attributes

Pkg. TypeSBDIP
Lead Count (#)28
Carrier TypeTube
Moisture Sensitivity Level (MSL)Not Applicable
Pitch (mm)2.5
Pkg. Dimensions (mm)35.6 x 15.1 x 2.41
DLA SMD5962R9562601TXC
Pb (Lead) FreeYes
Pb Free CategoryGold Plate over compliant Undercoat-e4
MOQ450
Temp. Range (°C)-55 to +125°C
CAGE code34371
Lead CompliantNo
Length (mm)35.6
Qualification LevelQML Class T (space lower level)
RatingSpace
TID HDR (krad(Si))100
Tape & ReelNo
Thickness (mm)2.41
Width (mm)15.1

Description

The Intersil Satellite Applications Flow™ (SAF) devices are fully tested and guaranteed to 100kRAD total dose. These QML Class T devices are processed to a standard flow intended to meet the cost and shorter lead-time needs of large volume satellite manufacturers while maintaining a high level of reliability. The Intersil HS-6664RH-T is a radiation hardened 64K CMOS PROM, organized in an 8K word by 8-bit format. The chip is manufactured using a radiation hardened CMOS process and utilizes synchronous circuit design techniques to achieve high-speed performance with very low power dissipation. On-chip address latches are provided, allowing easy interfacing with microprocessors that use a multiplexed address/data bus structure. The output enable control simplifies system interfacing by allowing output data bus control in addition to the chip enable control. All bits are manufactured storing a logical 0 and can be selectively programmed for a logical 1 at any bit location.