Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | DIE |
| Pkg. Code: | |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 0.0 x 0.0 x 0.00 |
| Pitch (mm): |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Pb (Lead) Free | Yes |
| ECCN (US) | 9A515.e.1 |
| HTS (US) | 8542.39.0090 |
| RoHS (HCTS541HMSR) | EnglishJapanese |
Product Attributes
| Pkg. Type | DIE |
| Carrier Type | Die Waffle Pack |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.00 |
| DLA SMD | 5962R9575101V9A |
| Pb (Lead) Free | Yes |
| Pb Free Category | None |
| MOQ | 100 |
| Temp. Range (°C) | -55 to +125°C |
| CAGE code | 34371 |
| DSEE (MeV·cm2/mg) | SEL free |
| Lead Compliant | No |
| Qualification Level | QML Class V (space) |
| Rating | Space |
| TID HDR (krad(Si)) | 200 |
| TID LDR (krad(Si)) | ELDRS free |
| Tape & Reel | No |
Resources for HCTS541MS
Description
The Intersil HCTS541MS is a radiation hardened noninverting octal buffer/line driver, three-state outputs. The output enable pins (OEN1 and OEN2) control the three-state outputs. If either enable is high, the outputs will be in the high impedance state. For data output, both enables (OEN1 and OEN2) must be low. The HCTS541MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of the radiation hardened, high-speed, CMOS/SOS logic family. The HCTS54 is supplied in a 20-lead ceramic flatpack (K suffix) or an SBDIP package (D suffix).