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Microcontrollers for Mobile Device Applications

Package Information

CAD Model:View CAD Model
Pkg. Type:TFQFP
Pkg. Code:pkg_736
Lead Count (#):100
Pkg. Dimensions (mm):14 x 14 x 1.2
Pitch (mm):0.5

Environmental & Export Classifications

RoHS (DF2227TE13V)EnglishJapanese
Moisture Sensitivity Level (MSL)
Pb (Lead) FreeYes
ECCN (US)
HTS (US)

Product Attributes

CPUH8S/2000
Bit Size16
RAM (KB)16
Program Memory (KB)128
Lead Count (#)100
Operating Freq (Max) (MHz)13.5
Timer8-bit x 2-ch, 16-bit x 3-ch
ADC10-bit x 8-ch
RTCYes
LVD or PVDNo
DMANo
EthernetNo
Temp. Range (°C)-20 to +75
Family NameH8S
Lead CompliantYes
Length (mm)14
MOQ1
Pb (Lead) FreeYes
Pkg. Dimensions (mm)14 x 14 x 1.2
Pkg. TypeTFQFP
Tape & ReelNo
Thickness (mm)1.2
Width (mm)14

Description

The H8S/2227 Group is supported only for customers who have already adopted these products. The RX230 is recommended for new designs.