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Microcontrollers for Mobile Device Applications

Package Information

CAD Model: View CAD Model
Pkg. Type: LFBGA
Pkg. Code: pkg_723
Lead Count (#): 112
Pkg. Dimensions (mm): 10 x 10 x 1.4
Pitch (mm): 0.8

Environmental & Export Classifications

Moisture Sensitivity Level (MSL)
RoHS (DF2215TBR24V) EnglishJapanese
Pb (Lead) Free Yes
ECCN (US)
HTS (US)

Product Attributes

CPU H8S/2000
Bit Size 16
RAM (KB) 20
Program Memory (KB) 256
Lead Count (#) 112
Operating Freq (Max) (MHz) 24
Timer 8-bit x 2-ch, 16-bit x 3-ch
ADC 10-bit x 6-ch
DAC 8-bit x 2-ch
RTC No
LVD or PVD No
DMA No
Ethernet No
USB USB Peripheral
Temp. Range (°C) -20 to +75
Family Name H8S
Lead Compliant Yes
Length (mm) 10
MOQ 1
Pb (Lead) Free Yes
Pkg. Dimensions (mm) 10 x 10 x 1.4
Pkg. Type LFBGA
Tape & Reel No
Thickness (mm) 1.4
Width (mm) 10

Description

The H8S/2215 Group is supported only for customers who have already adopted these products. The RX651 Group is recommended for new designs.