Skip to main content
Microcontrollers for Mobile Device Applications

Package Information

CAD Model:View CAD Model
Pkg. Type:LFBGA
Pkg. Code:pkg_723
Lead Count (#):112
Pkg. Dimensions (mm):10 x 10 x 1.4
Pitch (mm):0.8

Environmental & Export Classifications

RoHS (DF2214BR16V)EnglishJapanese
Moisture Sensitivity Level (MSL)
Pb (Lead) FreeYes
ECCN (US)
HTS (US)

Product Attributes

CPUH8S/2000
Bit Size16
Lead Count (#)112
Operating Freq (Max) (MHz)16
Timer16-bit x 3-ch
DAC8-bit x 1-ch
RTCNo
LVD or PVDNo
DMANo
EthernetNo
Temp. Range (°C)-20 to +75
Family NameH8S
Lead CompliantNo
Length (mm)10
MOQ1
Pb (Lead) FreeYes
Pkg. Dimensions (mm)10 x 10 x 1.4
Pkg. TypeLFBGA
Tape & ReelNo
Thickness (mm)1.4
Width (mm)10

Description

The H8S/2214 Group is supported only for customers who have already adopted these products. The RX231, RX651 Groups are recommended for new designs.