Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | LFQFP |
| Pkg. Code: | pkg_493 |
| Lead Count (#): | 64 |
| Pkg. Dimensions (mm): | 10 x 10 x 1.7 |
| Pitch (mm): | 0.5 |
Environmental & Export Classifications
| RoHS (R4F20102NFA#U0) | EnglishJapanese |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| CPU | H8S/2000 |
| Bit Size | 16 |
| RAM (KB) | 8 |
| Program Memory (KB) | 96 |
| Data Flash (KB) | 8 |
| Lead Count (#) | 64 |
| Operating Freq (Max) (MHz) | 20 |
| Timer | 8-bit x 2-ch, 16-bit x 4-ch |
| ADC | 10-bit x 8-ch |
| DAC | 8-bit x 2-ch |
| RTC | Yes |
| LVD or PVD | Yes |
| DMA | No |
| Ethernet | No |
| Temp. Range (°C) | -20 to +85 |
| Country of Assembly | CHINA |
| Country of Wafer Fabrication | JAPAN |
| Carrier Type | Tape |
| Family Name | H8S |
| Lead Compliant | Yes |
| Length (mm) | 10 |
| MOQ | 1 |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 10 x 10 x 1.7 |
| Pkg. Type | LFQFP |
| Price (USD) | $7.56588 |
| Tape & Reel | No |
| Thickness (mm) | 1.7 |
| Width (mm) | 10 |
Resources for H8S/20103
Description
The H8S/20115, 20103 Group is supported only for customers who have already adopted these products. The RX130, RX230, RL78/G14, RL78/I1C Groups are recommended.