Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | TFLGA |
| Pkg. Code: | pkg_609 |
| Lead Count (#): | 85 |
| Pkg. Dimensions (mm): | 7 x 7 x 1.2 |
| Pitch (mm): | 0.65 |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| PLP terminated | 2024 Jan (terminated) |
| CPU | H8/300H |
| Bit Size | 16 |
| RAM (KB) | 2 |
| Program Memory (KB) | 48 |
| Operating Freq (Max) (MHz) | 10 |
| Lead Count (#) | 85 |
| Timer | 16-bit x 4-ch |
| ADC | 10-bit x 8-ch |
| Ethernet | No |
| LVD or PVD | No |
| DMA | No |
| Temp. Range (°C) | -40 to +85 |
| Family Name | H8 |
| Lead Compliant | Yes |
| Length (mm) | 7 |
| MOQ | 1 |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 7 x 7 x 1.2 |
| Pkg. Type | TFLGA |
| RTC | No |
| Tape & Reel | No |
| Thickness (mm) | 1.2 |
| Width (mm) | 7 |
Resources for H8/38776
Description
The H8/38776 Group is supported only for the customers who have already adopted any of the products. For new adoption, please consider other products such as RL78/G14, RX113 Group.