Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | WAFER |
| Pkg. Code: | DICEW |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 0.0 x 0.0 x 0.0 |
| Pitch (mm): |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| Lead Count (#) | 0 |
| Carrier Type | WFP |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Temp. Range (°C) | -5 to 105°C |
| Application | 400/600Gbps 16/64QAM advanced multi-level modulation systems, High bandwidth SFF optical integrated modules |
| Channels (#) | 4 |
| Data Rate Max (Gbps) | 64 |
| Function | Linear Driver |
| MOQ | 70 |
| Output Type | Differential |
| Output Voltage (V) | 1.8 |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
| Pkg. Type | WAFER |
| Price (USD) | $383.80643 |
| Qty. per Carrier (#) | 0 |
| Qty. per Reel (#) | 0 |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Tape & Reel | No |
Resources for GX76473
Description
The GX76473 is a low-power, high-performance, quad-channel linear driver chip that is designed for 400G/600G optical integrated transmitter small-form factor (SFF) modules for metro and long-haul applications.
The GX76473 integrated quad lanes of driver with SPI circuitry for DC controls on a single die. Each channel of driver has 100Ω differential AC-coupled input and 100Ω differential DC-coupled output, and linear output voltage of 1.8Vppd suitable for InP multi-level modulations.