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Ultra-Low Power Stereo Codec with Differential Headphone Driver

Package Information

CAD Model: View CAD Model
Pkg. Type: 32-WLCSP
Pkg. Code:
Lead Count (#):
Pkg. Dimensions (mm): 4.56 x 1.98
Pitch (mm): 0.55

Environmental & Export Classifications

Moisture Sensitivity Level (MSL) 1
Pb (Lead) Free Yes
ECCN (US) EAR99
HTS (US) 8542.39.0090

Product Attributes

Carrier Type Tape & Reel
Moisture Sensitivity Level (MSL) 1
Pb (Lead) Free Yes
Country of Assembly TAIWAN
Country of Wafer Fabrication TAIWAN
ADC SNR A-weighted support(dB) @ 48kHz 105 @ 1.8V
Advanced Features 5bd EQ, 3bd Sidetone, ALC, Noise gate, Beep generator
Audio Interface 2-wire
DAC SNR A-weighted support(dB) @ 48kHz 110 @ 1.8V
Headphone Power Output 2 x 57mW @ 2.5V
MOQ 7500
Pitch (mm) 0.55
Pkg. Dimensions (mm) 4.56 x 1.98
Pkg. Type 32-WLCSP
Power Consumption During Playback 4mW @ 1.8V
Power Consumption During Record 2.5mW @ 1.8V
Price (USD) $1.96128
Published Yes
Qty. per Reel (#) 7500
Temp. Range (°C) -40 to +85°C

Description

The DA7217 is a high-performance, low power audio codec optimized for use in headsets or wearable devices. It has differential headphone outputs for use inside headset devices, offering excellent left to right channel separation and common mode noise rejection. DA7217 also has a stereo DAC to headphone output path and ultra-low power operating modes to support always-on audio detect applications.

DA7217 contains two analog microphone input paths, or up to four digital microphone input paths, or a combination of both. The other chip in this family, the DA7218, has single-ended headphone outputs, and has been designed with headphone detect for use in accessories.

Benefits

  • Superior hi-fidelity audio performance for immersive record and playback
  • Sub 500µW always-on power extends battery life for audio activity detection
  • Flexible programming filtering (sideband, voice) enhances voice and audio playback
  • Mixed sample rate support for wideband applications
  • Supports the latest generation of low power analog and digital microphones
  • Small package footprint with an optimized ballout conducive to low cost PCB manufacturing