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Multi-Core Bluetooth 5.2 SoC with System Power Management Unit

Package Information

CAD Model:View CAD Model
Pkg. Type:VFBGA
Pkg. Code:BV0100AA
Lead Count (#):100
Pkg. Dimensions (mm):5.0 x 5.0 x 0.82
Pitch (mm):0.48

Environmental & Export Classifications

Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
RoHS (DA14699-00000HR2)Download
ECCN (US)
HTS (US)

Product Attributes

Lead Count (#)100
Carrier TypeReel
Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
Pb Free CategoryN/A
Temp. Range (°C)0 to 70°C
Country of AssemblyTAIWAN
Country of Wafer FabricationTAIWAN
2MbpsSupported
ADC10-bit x 8-ch, 14-bit x 8-ch
AoASupported
AoDTX Supported
ApplicationRechargeable devices, HMI, Wearables, 'Analog' Smart Watches, ATLAS, Asset tracking, Connected health, Proximity tags & trackers, Wireless Ranging (WiRa)
Bluetooth® MeshNot Supported
CPUM33F
Clock Rate (MHz)96
Execute from FLASHYes
Extended AdvertisingSupported
External Rails and Load Capacity3x 1.8V @ 50mA each
Flash Memory (KB)0
Flexible System ClockYes
GATT CachingNot Supported
GPIOs (#)55
Hardware Crypto EngineYes
I2C (#)2
Integrated Battery ChargerYes, 560mA JEITA compliant charger
Integrated DCDCSIMO Buck DC-DC converter
LE Coded PHY (Long Range)Not Supported
LE Data Length ExtensionsSupported
Length (mm)5
Longevity2034 Jan
MCU/MPUM33
MOQ5000
Memory Size (OTP) (KB)4
Operating Freq (Max) (MHz)96
Output Power Range (dBm)-18 - 6
Periodic AdvertisingSupported
Pitch (mm)0.48
Pkg. Dimensions (mm)5.0 x 5.0 x 0.82
Pkg. TypeVFBGA
Price (USD)$6.54688
Proprietary 2G4 protocolYes
PublishedNo
QSPI Interface (#)2
Qty. per Carrier (#)0
Qty. per Reel (#)5000
RAM (KB)512KB
ROM (KB)128
Recommended for new DesignsYes
Reel Size (in)13
Rx current (mA)1.8
SPI (#)2
Sensitivity (dBm) (dBm)-97
Supply Voltage Vcc Range2.4-5.75
Tape & ReelYes
Thickness (mm)0.82
Tx Current (mA)3
UART (#)3
USB Ports (#)1
Width (mm)5
Wireless StandardBLE 5.2 Core specification + optional features

Description

The SmartBond™ DA1469x family of Bluetooth® Low Energy solutions is a feature-rich range of multi-core microcontroller units for wireless connectivity.

The product family builds off the successes of Renesas' SmartBond line, boasting three additional cores that offer greater processing power, resources, range, and battery life, enabling developers to push the boundaries of a wide array of connected consumer applications. The DA1469x line provides developers with advanced connectivity features to future-proof their devices and fit the needs of multiple applications. Based on the Arm® Cortex®-M33 processor, DA1469x products offer developers greater processing power for intensive applications like high-end fitness trackers, advanced smart home devices, and virtual reality game controllers.

Additionally, these wireless MCUs have a configurable MAC which enables manufacturers to deploy proprietary 2.4GHz and the latest Bluetooth Low Energy 5.2 protocol, opening up possibilities such as accurate positioning for Real-Time Location Systems (RTLS) and low latency communication exchange for applications like gaming. And, to enhance its sensing functionality, the line features a Sensor Node Controller (SNC) that runs autonomously and independently processes data from sensors connected to its interfaces.

Finally, the DA1469x family features a state-of-the-art Power Management Unit that utilizes best-in-class power management by controlling the different processing cores and only activating them as needed, while also eliminating the need for a separate PMIC and reducing the overall system size.

Benefits

  • Supports complex applications while guaranteeing extremely low power consumption
  • Software programmable protocol engine ensures end products are future proof
  • Enables a rich user experience
  • Provides banking-level security for application, data, and communication
  • Saves up to $1.28 on BOM vs. existing wireless MCUs
  • Saves up to 38mm2 of PCB space (components + routing) vs. existing wireless MCUs