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Renesas Electronics Corporation
SmartBond Multi-Core Bluetooth LE 5.2 SoC with Embedded Flash

Package Information

CAD Model:View CAD Model
Pkg. Type:WLCSP
Pkg. Code:WB0039AA
Lead Count (#):39
Pkg. Dimensions (mm):2.48 x 3.32 x 0.37
Pitch (mm):0.42

Environmental & Export Classifications

ECCN (US)3A991.a.2
HTS (US)8542.31.0070
Moisture Sensitivity Level (MSL)1
Pb (Lead) FreeYes

Product Attributes

Pkg. TypeWLCSP
Lead Count (#)39
Carrier TypeTape & Reel
Pitch (mm)0.42
Pkg. Dimensions (mm)2.48 x 3.32 x 0.37
Temp. Range (°C)-40 to +85°C
Country of AssemblyTAIWAN
Country of Wafer FabricationTAIWAN
2MbpsSupported
ADC15-bit x 8-ch, 10-bit x 8-ch
AoATX Supported
AoDTX Supported
ApplicationCrowd-sourced location tracking, Asset tracking, Connected health, HID, Metering, PoS, Beacons, AoA, AoD, IoT, Medical, Proximity tags & trackers, RCU
Bluetooth® MeshNot Supported
CPUM33 & M0+
Clock Rate (MHz)64
Execute from FLASHYes
Extended AdvertisingNot Supported
External Rails and Load CapacityNone
Flash Memory (KB)256KB
Flexible System ClockYes
GATT CachingNot Supported
GPIOs (#)32
Hardware Crypto EngineYes
I2C (#)1
Integrated Battery ChargerNo
Integrated DCDCIntegrated Buck DC-DC converter
LE Coded PHY (Long Range)Not Supported
LE Data Length ExtensionsSupported
MOQ8000
Memory Size (OTP) (KB)0
Moisture Sensitivity Level (MSL)1
Output Power Range (dBm)-22 - 6
Pb (Lead) FreeYes
Periodic AdvertisingNot Supported
Price (USD)$3.02141
Proprietary 2G4 protocolYes
QSPI Interface (#)1
Qty. per Reel (#)8000
RAM (KB)96KB
ROM (KB)288
Recommended for new DesignsYes
Rx current (mA)1.2
SPI (#)1
Sensitivity (dBm) (dBm)-97
Supply Voltage Vcc Range1.7-3.6
Tx Current (mA)2.3
UART (#)2
USB Ports (#)0
Wireless StandardBLE 5.2 Core specification

Description

Module available: DA14592MOD

The DA14592 is a mid-range Bluetooth® Low Energy (LE) SoC that offers the lowest power consumption and smallest solution footprint in its class. This SoC features multi-core processing (Arm® Cortex®-M33™, Arm Cortex-M0+) and includes on-chip memory (RAM/ROM/Flash) sized to support a broad range of applications while maintaining cost-effectiveness. Typical applications include connected medical devices, asset tracking, human interface devices, metering systems, PoS readers, and crowdsourced location (CSL) tracking. Notably, the DA14592 also includes a high-precision sigma-delta analog-to-digital converter (ADC), up to 32 GPIOs, and a QSPI for external memory (Flash or RAM) expansion, which is uncommon for this class of Bluetooth LE SoC.

The DA14592 maintains Renesas’ leadership in lowest radio power consumption by leveraging its new low-power mode, enabling a radio transmit current of only 2.3mA at 0dBm and a radio receive current of 1.2mA. Furthermore, it supports an ultra-low hibernation current of 90nA, which extends the shelf-life of end-products shipped with a connected battery. For products that require extensive application processing, it also boasts an ultra-low active current of 34µA/MHz.

The DA14592 typically requires only 6 external components, delivering best-in-class eBOM and offering the lowest solution cost and size. Its high accuracy on-chip RCX removes the need for an external, sleep mode crystal with most applications only requiring a 32MHz crystal. Package options include WLCSP (3.32mm x 2.48mm) and FCQFN (5.1mm x 4.3mm) offering an attractively small solution footprint. Additionally, it comes with a comprehensive suite of support tools, programming examples, Renesas' professionally staffed support forum, and industry-leading customer technical support.