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SmartBond Multi-Core Bluetooth LE 5.2 SoC with Embedded Flash

Package Information

CAD Model: View CAD Model
Pkg. Type: FCQFN
Pkg. Code:
Lead Count (#): 52
Pkg. Dimensions (mm): 5.1 x 4.3 x 0.78
Pitch (mm): 0.4

Environmental & Export Classifications

ECCN (US) 3A991.a.2
HTS (US) 8542.31.0070
RoHS (DA14592-010006F2) EnglishJapanese
Moisture Sensitivity Level (MSL) 3
Pb (Lead) Free Yes

Product Attributes

Pkg. Type FCQFN
Lead Count (#) 52
Carrier Type Tape & Reel
Pitch (mm) 0.4
Pkg. Dimensions (mm) 5.1 x 4.3 x 0.78
Temp. Range (°C) -40 to +85°C
Country of Assembly TAIWAN
Country of Wafer Fabrication TAIWAN
2Mbps Supported
ADC 15-bit x 8-ch, 10-bit x 8-ch
AoA TX Supported
AoD TX Supported
Application Crowd-sourced location tracking, Asset tracking, Connected health, HID, Metering, PoS, Beacons, AoA, AoD, IoT, Medical, Proximity tags & trackers, RCU
Bluetooth® Mesh Not Supported
CPU M33 & M0+
Clock Rate (MHz) 64
Execute from FLASH Yes
Extended Advertising Not Supported
External Rails and Load Capacity None
Flash Memory (KB) 256KB
Flexible System Clock Yes
GATT Caching Not Supported
GPIOs (#) 32
Hardware Crypto Engine Yes
I2C (#) 1
Integrated Battery Charger No
Integrated DCDC Integrated Buck DC-DC converter
LE Coded PHY (Long Range) Not Supported
LE Data Length Extensions Supported
MOQ 5500
Memory Size (OTP) (KB) 0
Moisture Sensitivity Level (MSL) 3
Output Power Range (dBm) -22 - 6
Pb (Lead) Free Yes
Periodic Advertising Not Supported
Price (USD) $3.31052
Proprietary 2G4 protocol Yes
QSPI Interface (#) 1
Qty. per Reel (#) 5500
RAM (KB) 96KB
ROM (KB) 288
Recommended for new Designs Yes
Rx current (mA) 1.2
SPI (#) 1
Sensitivity (dBm) (dBm) -97
Supply Voltage Vcc Range 1.7-3.6
Tx Current (mA) 2.3
UART (#) 2
USB Ports (#) 0
Wireless Standard BLE 5.2 Core specification

Description

Module available: DA14592MOD

The DA14592 is a mid-range Bluetooth® Low Energy (LE) SoC that offers the lowest power consumption and smallest solution footprint in its class. This SoC features multi-core processing (Arm® Cortex®-M33™, Arm Cortex-M0+) and includes on-chip memory (RAM/ROM/Flash) sized to support a broad range of applications while maintaining cost-effectiveness. Typical applications include connected medical devices, asset tracking, human interface devices, metering systems, PoS readers, and crowdsourced location (CSL) tracking. Notably, the DA14592 also includes a high-precision sigma-delta ADC, up to 32 GPIOs, and a QSPI for external memory (Flash or RAM) expansion, which is uncommon for this class of Bluetooth LE SoC.

The DA14592 maintains Renesas’ leadership in lowest radio power consumption by leveraging its new low-power mode, enabling a radio transmit current of only 2.3mA at 0dBm and a radio receive current of 1.2mA. Furthermore, it supports an ultra-low hibernation current of 90nA, which extends the shelf-life of end-products shipped with a connected battery. For products that require extensive application processing, it also boasts an ultra-low active current of 34µA/MHz.

The DA14592 typically requires only 6 external components, delivering best-in-class eBOM and offering the lowest solution cost and size. Its high accuracy on-chip RCX removes the need for an external, sleep mode crystal with most applications only requiring a 32MHz crystal. Package options include WLCSP (3.32mm x 2.48mm) and FCQFN (5.1mm x 4.3mm) offering an attractively small solution footprint. Additionally, it comes with a comprehensive suite of support tools, programming examples, Renesas' professionally staffed support forum, and industry-leading customer technical support.