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Package Information

CAD Model:View CAD Model
Pkg. Type:QFN
Pkg. Code:
Lead Count (#):40
Pkg. Dimensions (mm):5 x 5 x 0.9
Pitch (mm):0.45

Environmental & Export Classifications

Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
RoHS (DA14585-00000AT2)Download
ECCN (US)
HTS (US)

Product Attributes

Lead Count (#)40
Carrier TypeTape & Reel
Moisture Sensitivity Level (MSL)3
ApplicationBeacons, Proximity tags & trackers, HID, RCU
GPIOs (#)25
Pkg. Dimensions (mm)5 x 5 x 0.9
Qty. per Reel (#)5000
Rx current (mA)3.7
Tx Current (mA)3.4
Pb (Lead) FreeYes
Temp. Range (°C)-40 to +85°C
Country of AssemblyTAIWAN
Country of Wafer FabricationTAIWAN
2MbpsNot Supported
ADC10-bit x 4-ch
AoANot Supported
AoDNot Supported
Bluetooth® MeshNot Supported
CPUM0
Clock Rate (MHz)16
Execute from FLASHNo
Extended AdvertisingNot Supported
External Rails and Load Capacitynone
Flash Memory (KB)0
Flexible System ClockNo
GATT CachingNot Supported
Hardware Crypto EngineYes
I2C (#)1
Integrated Battery ChargerNo
Integrated DCDCIntegrated Buck/Boost DC-DC converter
LE Coded PHY (Long Range)Not Supported
LE Data Length ExtensionsSupported
Longevity2032 Jun
MCU/MPUM0
MOQ5000
Memory Size (OTP) (KB)64
Operating Freq (Max) (MHz)16
Output Power Range (dBm)-20
Periodic AdvertisingNot Supported
Pitch (mm)0.45
Pkg. TypeQFN
Price (USD)$3.1448
Proprietary 2G4 protocolNo
PublishedYes
QSPI Interface (#)0
RAM (KB)96KB
ROM (KB)128
Recommended for new DesignsYes
SPI (#)1
Sensitivity (dBm) (dBm)-93
Supply Voltage Vcc Range0.9-3.3
UART (#)2
USB Ports (#)0
Wireless StandardBLE 5.0 Core specification

Description

Connected devices are constantly evolving. New generations appear that are smarter, more full-featured and have longer battery lifetimes. To enable this, SmartBond™ has evolved too. SmartBond 5.0 is smarter, more flexible, and even lower power. The DA14585 offers designers all the benefits of the industry-leading DA1458x but with even greater flexibility to create more advanced applications from the smallest footprints and power budgets.

As part of the SmartBond family, the DA14585 is one of the smallest, lowest power and most integrated Bluetooth® solutions available. This versatile system-on-chip (SoC) is ideal for adding Bluetooth Low Energy (LE) to products like remote controls, proximity tags, beacons, connected medical devices, and smart home nodes. It supports all Bluetooth developments up to Bluetooth 5. Plus, with 96kB of RAM, the DA14585 has double the memory for user applications of its predecessor to take full advantage of the standard's features. It also includes an integrated microphone interface for voice support at low additional cost. The wide supply voltage range (0.9V to 3.6V) covers a larger choice of energy sources and gives full design flexibility.

Like all SmartBond solutions, the DA14585 is easy to design-in and supports standalone as well as hosted applications. It is supported by a complete development environment and the SmartSnippets™ software that helps you optimize your software for power consumption.

Benefits

  • Large memory to build complex applications
  • Longest battery life
  • Low system Bill of Materials (BOM)

Packages

  • QFN-40 (5.0mm x 5.0mm x 0.9mm)
  • WLCSP-34 (2.4mm x 2.66mm x 0.39mm)