| CAD Model: | View CAD Model |
| Pkg. Type: | QFN |
| Pkg. Code: | LCZ |
| Lead Count (#): | 68 |
| Pkg. Dimensions (mm): | 10.01 x 10.01 x 0.90 |
| Pitch (mm): | 0.5 |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
| Pkg. Type | QFN |
| Carrier Type | Tube |
| MOQ | 600 |
| Advanced Features | D2 Audio PWM Engine, Graceful Fault Recovery, SRS WOW/HD™ |
| D2 Audio DSP Customization GUI | Yes |
| Input Channels | 2 |
| Integrated Power Stages | 4 |
| Lead Count (#) | 68 |
| Length (mm) | 10 |
| Moisture Sensitivity Level (MSL) | 3 |
| PWM Output Channels | 5 |
| Pb (Lead) Free | Yes |
| Pb Free Category | Nickel/Palladium/Gold-e4 |
| Pitch (mm) | 0.5 |
| Pkg. Dimensions (mm) | 10.0 x 10.0 x 0.90 |
| Qualification Level | Standard |
| Signal Flow | Fixed |
| Supported Audio Inputs | 1x I2S, 1x S/PDIF |
| Supported Audio Outputs | 4x Power, 3x PWM, 1x S/PDIF |
| Supported Decoders | None |
| Temp. Range (°C) | 0 to +70°C |
| Thickness (mm) | 0.9 |
| Width (mm) | 10 |
The D2-4P (D2-45057 and D2-45157) devices are complete System-on-Chip (SoC) Class-D digital audio amplifiers. These devices combine high performance integrated Power Stages, an optimized Audio Processor feature set, and a PWM controller to offer a complete, powerful, and very cost effective audio solution for high volume and cost-critical products. This 4th generation Digital Audio Processor (D2-4P) device combines extensive integrated Digital Signal Processor (DSP) audio processing with amplifier control for a complete audio solution. Its ease of integration into the existing system processor provides complete support for all system product and amplifier functions. The four configurable Power Stages operate as four separate Half-Bridge outputs, as two Full-Bridge outputs, or in combinations of Half-Bridge plus Full-Bridge, which provides flexible loudspeaker drive solutions. Separate PWM outputs provide additional combinations to drive headphone outputs or line level stereo and subwoofer outputs.