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CMOS Hex Buffer

Package Information

CAD Model:View CAD Model
Pkg. Type:SBDIP
Pkg. Code:DAV
Lead Count (#):16
Pkg. Dimensions (mm):20.3 x 7.5 x 2.41
Pitch (mm):2.5

Environmental & Export Classifications

Moisture Sensitivity Level (MSL)Not Applicable
Pb (Lead) FreeExempt
ECCN (US)
HTS (US)

Product Attributes

Pkg. TypeSBDIP
Lead Count (#)16
Carrier TypeTube
Moisture Sensitivity Level (MSL)Not Applicable
Pitch (mm)2.5
Pkg. Dimensions (mm)20.3 x 7.5 x 2.41
DLA SMD5962R9664301VEC
Pb (Lead) FreeExempt
Pb Free CategoryGold Plate over compliant Undercoat-e4
MOQ25
Temp. Range (°C)-55 to +125°C
CAGE code34371
DSEE (MeV·cm2/mg)75
Length (mm)20.3
Qualification LevelQML Class V (space)
RatingSpace
TID HDR (krad(Si))100
TID LDR (krad(Si))ELDRS free
Thickness (mm)2.41
Width (mm)7.5

Description

CD4503BMS is a hex noninverting buffer with 3 state outputs that have high sink and source current capability. Two disable controls are provided, one of which controls four buffers and the other controls the remaining two buffers. The CD4503BMS is supplied in these 16-lead outline packages: Braze Seal DIP H4T, Frit Seal DIP H1E, Ceramic Flatpack H6W.