Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | SBDIP |
| Pkg. Code: | HSG |
| Lead Count (#): | 14 |
| Pkg. Dimensions (mm): | 19.00 x 7.37 x 2.41 |
| Pitch (mm): | 2.54 |
Environmental & Export Classifications
| Pb (Lead) Free | No |
| Moisture Sensitivity Level (MSL) | |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| Pkg. Type | SBDIP |
| Lead Count (#) | 14 |
| Carrier Type | Tube |
| Pitch (mm) | 2.5 |
| Pkg. Dimensions (mm) | 19.0 x 7.4 x 2.41 |
| DLA SMD | 5962-96654 |
| Pb (Lead) Free | No |
| MOQ | 15 |
| Temp. Range (°C) | -55 to +125°C |
| DSEE (MeV·cm2/mg) | 75 |
| Length (mm) | 19 |
| Qualification Level | QML Class V (space) |
| Rating | Space |
| TID HDR (krad(Si)) | 100 |
| TID LDR (krad(Si)) | ELDRS free |
| Thickness (mm) | 2.41 |
| Width (mm) | 7.4 |
Resources for CD4071BMS
Description
Support is limited to customers who have already adopted these products.
CD4071BMS, CD4072BMS and CD4075BMS OR gates provide the system designer with direct implementation of the positive-logic OR function and supplement the existing family of CMOS gates. The CD4071BMS, CD4072BMS and CD4075BMS are supplied in these 14 lead outline packages: Braze Seal DIP *H4H †H4Q Frit Seal DIP H1B Ceramic Flatpack H3W *CD4071, CD4072 †CD4075 Only