Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | DIE |
| Pkg. Code: | |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 0.0 x 0.0 x 0.00 |
| Pitch (mm): |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Pb (Lead) Free | Yes |
| RoHS (CD4023BHSR) | EnglishJapanese |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| Pkg. Type | DIE |
| Carrier Type | Die Waffle Pack |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.00 |
| DLA SMD | 5962R9662103V9A |
| Pb (Lead) Free | Yes |
| Pb Free Category | None |
| MOQ | 100 |
| Temp. Range (°C) | -55 to +125°C |
| DSEE (MeV·cm2/mg) | 75 |
| Lead Compliant | No |
| Qualification Level | QML Class V (space) |
| Rating | Space |
| TID HDR (krad(Si)) | 100 |
| TID LDR (krad(Si)) | ELDRS free |
| Tape & Reel | No |
Resources for CD4023BMS
Description
The CD4023BMS is a triple 3-input CMOS NAND gate that provides the system designer with direct implementation of the NAND function and supplements the existing family of CMOS gates. All inputs and outputs are buffered. The CD4023BMS is supplied in these 14-lead outline packages: Braze Seal DIP H4Q, Frit Seal DIP H1B and a Ceramic Flatpack H3W.