| CAD Model: | View CAD Model |
| Pkg. Type: | |
| Pkg. Code: | |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 5.18 x 7.70 |
| Pitch (mm): | 1.27 |
| Moisture Sensitivity Level (MSL) | 1 |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.32.0051 |
| Pb (Lead) Free | Yes |
| Sample Catalog | Request Samples |
| Carrier Type | Tape & Reel |
| Moisture Sensitivity Level (MSL) | 1 |
| Country of Assembly | TAIWAN |
| Country of Wafer Fabrication | CHINA |
| Active Interrupt | Yes |
| Deep Power Down (µA) | 0.007 |
| Flash by Task | Boot Loader, Datalogging, Execute-in-Place, System Settings, Micron Replacement |
| Flexible Read/Write Buffer | Yes |
| Interface | Single, Dual, Quad SPI |
| Key Benefit | 70% energy savings |
| Longevity | 2030 Jan |
| MOQ | 6000 |
| Memory Class | FusionHD |
| Memory Density | 8 Mbit |
| Operating Voltage Range (V) | 1.65 - 3.6 |
| Pb (Lead) Free | Yes |
| Pitch (mm) | 1.27 |
| Pkg. Dimensions (mm) | 5.18 x 7.70 |
| Price (USD) | $0.5806 |
| Published | Yes |
| Qty. per Reel (#) | 2000 |
| Read Current (mA) | 5.6 |
| Read Modify Write | Yes |
| Speed | 133 MHz |
| Temp. Range (°C) | -40 to +85°C |
The AT25XE081D is a member of our System Enhancing class of code and data storage solutions designed for all system memory tasks ranging from boot/code shadowing to data logging of frequently changing data. It is universally compatible and includes extra features that save system energy and overhead.