Package Information
| CAD Model: | View CAD Model |
| Pkg. Type: | TSSOP |
| Pkg. Code: | |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 2.9 x 4.31 |
| Pitch (mm): | 0.65 |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
Product Attributes
| Pkg. Type | TSSOP |
| Carrier Type | Tape & Reel |
| Moisture Sensitivity Level (MSL) | 1 |
| Country of Assembly | PHILIPPINES |
| Country of Wafer Fabrication | TAIWAN |
| Deep Power Down (µA) | 0.35 |
| Flash by Task | Boot Loader |
| Interface | Single, Dual SPI |
| Key Benefit | Fast read, 2.3 Volt |
| MOQ | 8000 |
| Memory Class | FusionHD |
| Memory Density | 256 Kbit |
| Operating Voltage Range (V) | 2.3 - 3.6 |
| Pb (Lead) Free | Yes |
| Pitch (mm) | 0.65 |
| Pkg. Dimensions (mm) | 2.9 x 4.31 |
| Price (USD) | $0.3818 |
| Published | Yes |
| Qty. per Reel (#) | 4000 |
| Read Current (mA) | 6 |
| Speed | 104 MHz |
| Supply Voltage Vcc (V) | 2.3 - 2.3 |
| Supply Voltage Vcc Range | 2.3-3.6 |
| Temp. Range (°C) | -40 to +85°C |
Resources for AT25DN256
Description
The AT25DN256 is a serial interface Flash memory device designed for use in a wide variety of high-volume consumer-based applications in which program code is shadowed from Flash memory into embedded or external RAM for execution. The flexible erase architecture of the AT25DN256, with its page erase granularity, is ideal for data storage, as well, eliminating the need for additional data storage devices.