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Renesas Electronics Corporation
2.5V,3.3V ECL/LVPECL Clock /Data Fanout Buffer

Package Information

CAD Model:View CAD Model
Pkg. Type:VFQFPN
Pkg. Code:NLG16
Lead Count (#):16
Pkg. Dimensions (mm):3.0 x 3.0 x 1.0
Pitch (mm):0.5

Environmental & Export Classifications

Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
ECCN (US)EAR99
HTS (US)8542.39.0090

Product Attributes

Lead Count (#)16
Carrier TypeTray
Moisture Sensitivity Level (MSL)3
Qty. per Reel (#)0
Qty. per Carrier (#)624
Pb (Lead) FreeYes
Pb Free Categorye3 Sn
Temp. Range (°C)-40 to 85°C
Additive Phase Jitter Typ RMS (fs)45
Additive Phase Jitter Typ RMS (ps)0.045
Adjustable PhaseNo
Channels (#)1
Core Voltage (V)2.5V, 3.3V
FunctionBuffer
Input Freq (MHz)3000
Input TypeCML, LVDS, LVPECL
Inputs (#)1
Length (mm)3
MOQ624
Noise Floor (dBc/Hz)-162
Output Banks (#)1
Output Freq Range (MHz)3000
Output Skew (ps)17
Output TypeLVPECL
Output Voltage (V)2.5V, 3.3V
Outputs (#)2
Package Area (mm²)9
Pitch (mm)0.5
Pkg. Dimensions (mm)3.0 x 3.0 x 1.0
Pkg. TypeVFQFPN
Product CategoryClock Buffers & Drivers, RF Buffers
PublishedNo
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Supply Voltage (V)2.5 - 2.5, 3.3 - 3.3
Tape & ReelNo
Thickness (mm)1
Width (mm)3

Description

The 853S9252I is a 2.5V/3.3V ECL/LVPECL fanout buffer designed for high-speed, low phase-noise wireless infrastructure applications. The device fanouts a differential input signal to two ECL/LVPECL outputs. Optimized for low additive phase-noise, sub-100ps output rise and fall times, low output skew and high-frequencies, the 853S9252I is an effective solution for high-performance clock and data distribution applications, for instance driving the reference clock inputs of ADC/DAC circuits. Internal input termination, a bias voltage output (VREF) for AC-coupling and small packaging (3.0mm x 3.0mm 16-lead VFQFN) supports space-efficient board designs. The 853S9252I operates from a full 2.5V or 3.3V power supply and supports the industrial temperature range of -40°C to 85°C. The extended temperature range also supports wireless infrastructure, tele-communication and networking end equipment requirements.