Skip to main content
Renesas Electronics Corporation
2K x 9 DualAsync FIFO, 3.3V

Package Information

CAD Model:View CAD Model
Pkg. Type:TSSOP
Pkg. Code:PAG56
Lead Count (#):56
Pkg. Dimensions (mm):14.0 x 6.1 x 1.0
Pitch (mm):0.5

Environmental & Export Classifications

Moisture Sensitivity Level (MSL)1
Pb (Lead) FreeYes
ECCN (US)
HTS (US)

Product Attributes

Carrier TypeReel
Access Time (ns)20
ArchitectureDual FIFO
Bus Width (bits)9
Core Voltage (V)3.3
Density (Kb)18
Family NameDualAsync
I/O Type3.3 V LVTTL
InterfaceAsynchronous
Lead Count (#)56
Length (mm)14
MOQ2000
Moisture Sensitivity Level (MSL)1
Organization2K x 9
Package Area (mm²)85.4
Pb (Lead) FreeYes
Pb Free Categorye3 Sn
Pitch (mm)0.5
Pkg. Dimensions (mm)14.0 x 6.1 x 1.0
Pkg. TypeTSSOP
Qty. per Carrier (#)0
Qty. per Reel (#)2000
Reel Size (in)13
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelYes
Temp. Range (°C)-40 to 85°C
Thickness (mm)1
Width (mm)6.1

Description

The 72V83 is a dual-FIFO memory that loads and empties data on a first-in/first-out basis. It utilizes a 9-bit wide data array to allow for control and parity bits at the user's option. This is useful in data communications applications where a parity bit is needed for transmission/reception error checking. It is designed for those applications requiring asynchronous and simultaneous read/writes in multiprocessing and rate buffer applications.