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8K x 36 SuperSync II FIFO, 3.3V

Package Information

CAD Model:View CAD Model
Pkg. Type:TQFP
Pkg. Code:PKG128
Lead Count (#):128
Pkg. Dimensions (mm):20.0 x 14.0 x 1.4
Pitch (mm):0.5

Environmental & Export Classifications

Pb (Lead) FreeYes
Moisture Sensitivity Level (MSL)3
ECCN (US)EAR99
HTS (US)8542.32.0071

Product Attributes

Lead Count (#)128
Pb (Lead) FreeYes
Carrier TypeTray
Moisture Sensitivity Level (MSL)3
Country of AssemblyTAIWAN
Country of Wafer FabricationTAIWAN, UNITED STATES
ArchitectureUni-directional
Bus Width (bits)36
Core Voltage (V)3.3
Density (Kb)288
Family NameSuperSync II
FunctionBus Matching, JTAG
I/O Frequency (MHz)100 - 100
I/O Type3.3 V LVTTL
InterfaceSynchronous
Length (mm)20
MOQ36
Organization8K x 36
Package Area (mm²)280
Pb Free Categorye3 Sn
Pitch (mm)0.5
Pkg. Dimensions (mm)20.0 x 14.0 x 1.4
Pkg. TypeTQFP
Price (USD)$102.98
PublishedNo
Qty. per Carrier (#)72
Qty. per Reel (#)0
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelNo
Temp. Range (°C)0 to 70°C
Thickness (mm)1.4
Width (mm)14

Description

The 72V3670 8K x 36 SuperSync II FIFO memory with clocked read and write controls offers flexible Bus-Matching x36/x18/x9 data flow and Asynchronous/Synchronous translation on the read or write ports ; SuperSync II FIFO's are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes.