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128K x 36 SuperSync II FIFO, 3.3V

Package Information

CAD Model: View CAD Model
Pkg. Type: TQFP
Pkg. Code: PKG128
Lead Count (#): 128
Pkg. Dimensions (mm): 20.0 x 14.0 x 1.4
Pitch (mm): 0.5

Environmental & Export Classifications

Pb (Lead) Free Yes
Moisture Sensitivity Level (MSL) 3
ECCN (US) EAR99
HTS (US) 8542.32.0071

Product Attributes

Lead Count (#) 128
Pb (Lead) Free Yes
Carrier Type Tray
Moisture Sensitivity Level (MSL) 3
Country of Assembly TAIWAN
Country of Wafer Fabrication TAIWAN, UNITED STATES
Architecture Uni-directional
Bus Width (bits) 36
Core Voltage (V) 3.3
Density (Kb) 4096
Family Name SuperSync II
Function Bus Matching, JTAG
I/O Frequency (MHz) 166 - 166
I/O Type 3.3 V LVTTL
Interface Synchronous
Length (mm) 20
MOQ 36
Organization 128K x 36
Package Area (mm²) 280
Pb Free Category e3 Sn
Pitch (mm) 0.5
Pkg. Dimensions (mm) 20.0 x 14.0 x 1.4
Pkg. Type TQFP
Price (USD) $169.85
Published No
Qty. per Carrier (#) 72
Qty. per Reel (#) 0
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Tape & Reel No
Temp. Range (°C) 0 to 70°C
Thickness (mm) 1.4
Width (mm) 14

Description

The 72V36110 128K x 36 SuperSync II FIFO memory with clocked read and write controls offers flexible bus-matching x36/x18/x9 data flow and asynchronous/synchronous translation on the read or write ports. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications, and other applications that need to buffer large amounts of data and match buses of unequal sizes.