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Renesas Electronics Corporation
32K x 18 SuperSync FIFO, 3.3V

Package Information

CAD Model:View CAD Model
Pkg. Type:TQFP
Pkg. Code:PP64
Lead Count (#):64
Pkg. Dimensions (mm):10.0 x 10.0 x 1.4
Pitch (mm):0.5

Environmental & Export Classifications

Pb (Lead) FreeNo
Moisture Sensitivity Level (MSL)3
ECCN (US)
HTS (US)

Product Attributes

Lead Count (#)64
Pb (Lead) FreeNo
Carrier TypeTray
Moisture Sensitivity Level (MSL)3
ArchitectureUni-directional
Bus Width (bits)18
Core Voltage (V)3.3
Density (Kb)512
Family NameSuperSync
I/O Frequency (MHz)66 - 66
I/O Type3.3 V LVTTL
InterfaceSynchronous
Length (mm)10
MOQ80
Organization32K x 18
Package Area (mm²)100
Pb Free Categorye0
Pitch (mm)0.5
Pkg. Dimensions (mm)10.0 x 10.0 x 1.4
Pkg. TypeTQFP
Qty. per Carrier (#)160
Qty. per Reel (#)0
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelNo
Temp. Range (°C)-40 to 85°C
Thickness (mm)1.4
Width (mm)10

Description

The 72V275 is a 32K x 18 SuperSync FIFO memory with clocked read and write controls. It's a functionally compatible version of the 72275 designed to run off a 3.3V supply for very low power consumption. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. SuperSync FIFOs are particularly appropriate for networking, video, telecommunications, data communications and other applications that need to buffer large amounts of data.