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16K x 18 / 32K x 9 SuperSync II FIFO, 3.3V

Package Information

CAD Model:View CAD Model
Pkg. Type:TQFP
Pkg. Code:PNG80
Lead Count (#):80
Pkg. Dimensions (mm):14.0 x 14.0 x 1.4
Pitch (mm):0.65

Environmental & Export Classifications

Pb (Lead) FreeYes
Moisture Sensitivity Level (MSL)3
ECCN (US)
HTS (US)

Product Attributes

Lead Count (#)80
Pb (Lead) FreeYes
Carrier TypeTray
Moisture Sensitivity Level (MSL)3
ArchitectureUni-directional
Bus Width (bits)18
Core Voltage (V)3.3
Density (Kb)288
Family NameSuperSync II
FunctionBus Matching, JTAG
I/O Frequency (MHz)100 - 100
I/O Type3.3 V LVTTL
InterfaceSynchronous
Length (mm)14
MOQ45
Organization16K x 18, 32K x 9
Package Area (mm²)196
Pb Free Categorye3 Sn
Pitch (mm)0.65
Pkg. Dimensions (mm)14.0 x 14.0 x 1.4
Pkg. TypeTQFP
Price (USD)$93.12444
PublishedNo
Qty. per Carrier (#)90
Qty. per Reel (#)0
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelNo
Temp. Range (°C)0 to 70°C
Thickness (mm)1.4
Width (mm)14

Description

The 72V273 32K x 9/16K x 18 SuperSync II FIFO memory has flexible x9/x18 bus-matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications, and other applications that need to buffer large amounts of data and match buses of unequal sizes.