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8K x 18 / 16K x 9 SuperSync II FIFO, 3.3V

Package Information

CAD Model: View CAD Model
Pkg. Type: TQFP
Pkg. Code: PNG80
Lead Count (#): 80
Pkg. Dimensions (mm): 14.0 x 14.0 x 1.4
Pitch (mm): 0.65

Environmental & Export Classifications

Pb (Lead) Free Yes
Moisture Sensitivity Level (MSL) 3
ECCN (US) EAR99
HTS (US) 8542.32.0071

Product Attributes

Lead Count (#) 80
Pb (Lead) Free Yes
Carrier Type Tray
Moisture Sensitivity Level (MSL) 3
Country of Assembly PHILIPPINES
Country of Wafer Fabrication TAIWAN, UNITED STATES
Architecture Uni-directional
Bus Width (bits) 18
Core Voltage (V) 3.3
Density (Kb) 144
Family Name SuperSync II
Function Bus Matching, JTAG
I/O Frequency (MHz) 166 - 166
I/O Type 3.3 V LVTTL
Interface Synchronous
Length (mm) 14
MOQ 100
Organization 16K x 9, 8K x 18
Package Area (mm²) 196
Pb Free Category e3 Sn
Pitch (mm) 0.65
Pkg. Dimensions (mm) 14.0 x 14.0 x 1.4
Pkg. Type TQFP
Price (USD) $77.9928
Published No
Qty. per Carrier (#) 90
Qty. per Reel (#) 0
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Tape & Reel No
Temp. Range (°C) 0 to 70°C
Thickness (mm) 1.4
Width (mm) 14

Description

The 72V263 16K x 9/8K x 18 SuperSync II FIFO memory has flexible x9/x18 bus-matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications, and other applications that need to buffer large amounts of data and match buses of unequal sizes.