Skip to main content
2K x 18 / 4K x 9 SuperSync II FIFO, 3.3V

Package Information

CAD Model:View CAD Model
Pkg. Type:CABGA
Pkg. Code:BCG100
Lead Count (#):100
Pkg. Dimensions (mm):11.0 x 11.0 x 1.4
Pitch (mm):1

Environmental & Export Classifications

Pb (Lead) FreeYes
Moisture Sensitivity Level (MSL)3
ECCN (US)
HTS (US)

Product Attributes

Lead Count (#)100
Pb (Lead) FreeYes
Carrier TypeTray
Moisture Sensitivity Level (MSL)3
ArchitectureUni-directional
Bus Width (bits)18
Core Voltage (V)3.3
Density (Kb)36
Family NameSuperSync II
FunctionBus Matching, JTAG
I/O Frequency (MHz)166 - 166
I/O Type3.3 V LVTTL
InterfaceSynchronous
Length (mm)11
MOQ100
Organization2K x 18, 4K x 9
Package Area (mm²)121
Pb Free Categorye1 SnAgCu
Pitch (mm)1
Pkg. Dimensions (mm)11.0 x 11.0 x 1.4
Pkg. TypeCABGA
Price (USD)$48.8531
PublishedNo
Qty. per Carrier (#)168
Qty. per Reel (#)0
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelNo
Temp. Range (°C)0 to 70°C
Thickness (mm)1.4
Width (mm)11

Description

The 72V243 4K x 9/2K x 18 SuperSync II FIFO memory has flexible x9/x18 bus-matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications, and other applications that need to buffer large amounts of data and match buses of unequal sizes.